Sony MDS-JE630 Precautions for Checking Laser Diode Emission, Precautions for Adjustments

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2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION

To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.

3. PRECAUTIONS FOR USE OF OPTICAL PICK-UP (KMS-260A)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before con- necting the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

flexible board

 

laser tap

Optical pick-up flexible board

4. PRECAUTIONS FOR ADJUSTMENTS

1.When replacing the following parts, perform the adjustments and checks with Âin the order shown in the following table.

 

Optical

 

 

 

BD Board

 

 

Pick-up

IC171

D101

 

IC101, IC121

IC192

 

 

 

 

 

 

 

 

1. Initial setting of

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Â

G

 

Â

G

adjustment value

 

 

 

 

 

 

 

 

 

 

2. Recording of IOP

 

 

 

 

 

 

 

information

Â

 

Â

G

 

G

G

(Value on the

 

 

 

 

 

 

 

 

 

pick-up label)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3. Temperature

 

 

 

 

 

 

 

compensation

G

Â

Â

 

G

G

offset adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4. Laser power

Â

 

Â

G

 

Â

Â

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5. Traverse

Â

 

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6. Focus bias

Â

 

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

7. Error rate check

Â

 

Â

G

 

Â

G

 

 

 

 

 

 

 

 

8. Auto gain output

Â

 

Â

G

 

Â

G

level adjustment

 

 

 

 

 

 

 

2.Set the test mode when performing adjustments.

After completing the adjustments, release the test mode. Perform the adjustments and checks in “group S” of the test mode.

3.Perform the adjustments to be needed in the order shown.

4.Use the following tools and measuring devices.

• Check Disc (MD) TDYS-1

(Part No. 4-963-646-01)

•TEST DISK (MDW-74/AU-1) (Part No. 8-892-341-41)

•Laser power meter LPM-8001 (Part No. J-2501-046-A) or MD Laser power meter 8010S (Part No. J-2501-145-A)

•Oscilloscope (Measure after performing CAL of prove)

•Digital voltmeter

•Thermometer

•Jig for checking BD board waveform

(Part No. : J-2501-149-A)

5.When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscil- loscope.

(VC and ground will become short-circuited)

6.Using the above jig enables the waveform to be checked with- out the need to solder.

(Refer to Servicing Notes on page 6)

7.As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

Laser power meter

When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (Part No. J-2501-145-A) instead of the conventional laser power meter is convenient.

It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of optical pick-up.

5.CREATING CONTINUOUSLY-RECORDED DISC

* This disc is used in focus bias adjustment and error rate check. The following describes how to create a continuous recording disc.

1.Insert a disc (blank disc) commercially available.

2.Turn the [ÊÊÊÊÊÊÊÊAMSÊÊÊÊÊÊÊÊ]- ± knob and display “CREC MODE”. (C31)

3.Press the [YES] button again to display “CREC MID”. Display “CREC (0300)” and start to recording.

4.Complete recording within 5 minutes.

5.Press the [MENU/NO] button and stop recording .

6.Press the [ÊÊÊÊÊEJECT]¤ button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment/check and MO error rate check.

Note :

• Be careful not to apply vibration during continuous recording.

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Contents MBU-5D SpecificationsMDS-JE520 MDM-5DSELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Section Servicing Notes Table of ContentsDiagrams Flexible Circuit Board Repairing IOP JIG for Checking BD Board WaveformRecord Procedure Criteria for Determination Measure if unsatisfactory Checks Prior to Parts Replacement and AdjustmentsProcedure Retry Cause Display ModeHexadecimal nBinary Conversion Table Front Panel Rear Panel Section GeneralLocation of Controls Page Front Panel Section Section DisassemblyCase Mechanism Deck Section MDM-5D Main BoardBase Unit MBU-5D, BD Board Slider CAMSW BOARD, Loading Motor M103 Releasing the Test Mode Section Test ModePrecautions for USE of Test Mode Setting the Test ModeDisplay Contents Mark Group Selecting the Test ModeOUT Operating the Continuous Playback ModeNon-Volatile Memory Mode EEP Mode MIDFunctions of Other Buttons Test Mode DisplaysMeanings of Other Displays Parts Replacement and Adjustment Section Electrical AdjustmentsLaser power meter Precautions for Checking Laser Diode EmissionPrecautions for USE of Optical PICK-UP KMS-260A Precautions for AdjustmentsTraverse Check Temperature Compensation Offset CheckLaser Power Check Check Prior to RepairsSelf-Recording/playback Check Play Check MO Error Rate CheckCD Error Rate Check Focus Bias CheckRecording and Displaying the IOP Information Initial Setting of Adjustment ValueTemperature Compensation Offset Adjustment Laser Power AdjustmentTraverse Adjustment Focus Bias Adjustment MO Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment CD Auto Gain Control Output Level AdjustmentAdjustment Location MDS-JE630 Section DiagramsBlock Diagram Servo Section ∙ Signal PathREC Analog Block Diagram Main SectionPlay Analog OUT Circuit Boards Location Semiconductor Location Printed Wiring Board BD BoardSee page 36 for Circuit Boards Location MDS-JE630 43 for Waveforms. See page 56 for IC Block Diagrams Schematic Diagram BD Board 2/2 SeeMain Board Schematic Diagram SW BoardPrinted Wiring Board SW Board Waveforms BD Board36 for Circuit Boards Location Semiconductor Location Printed Wiring Board Main Board SeeSchematic Diagram Main Board 1/2 See page 43 for Waveforms Line with mark !are critical for safety Ref. No Location D757 IC761 IC771 Q757 Q781 Q782 Schematic Diagram Panel Section See page 43 for Waveform IC152 BH6511FS-E2 IC Block Diagrams BD Board IC101IC121 CXD2656R IC471 LB1641 Main Board IC310 M5293L IC431 LA5632IC321 AK4524 IC PIN Function Description Xrst XlatSrdt SensAsyi XrasXWE AsyoSpfd SrdrSfdr SprdRST AderByte CnvssLD-LOW STBChack LdinClock SET1 SCLSctx Clock SET012 A-4724-696-A Main BOARD, Complete Section Exploded ViewsChassis Section 17 #167 A-4724-697-A KEY SW BOARD, Complete 65 A-4724-698-A Display BOARD, Complete209 4-988-466-21 Spring ELECTROSTATIC, Leaf Mechanism Section216 207 203 222 223 225 202 201 226 206 204Base Unit Section MBU-5D Section Electrical Parts List Display Display HP KEY KEY SW KEY SW Main GP1F38R Digital in OPT2 Ground PlateTC74HCU04AP GP1F38R Digital in OPT1Line Filter Ferrite Bead InductorMain Power SW SW MANUAL, Instruction ENGLISH, French Accessories & Packing MaterialsCORD, Connection Audio
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MDS-JE630 specifications

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