HTC Rev. A05 Board Level 2.5 Repairs, „ Basic Repair Instructions for Component Replacement

Page 103

HTC Corporation

.

Doc. Title

Diamond Service Manual

Doc. No.

DOC-00040624 REV.

Issued Date

2008/4/14

 

A05

Revised Date

2008/6/23

Page

103 of 109

9.2 Board Level 2.5 Repairs

„Basic Repair Instructions for Component Replacement:

Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.

WarningDO NOT overheat the tape and components to avoid the tape melted and the components damaged

Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the components.

Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components being removed

Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder and flux residues.

Notice:

A.Checking the polarity of CON8, and the position can't be shifted.

B.Checking the polarity of SW8SW7, and it can't be reversed.

C.All the parts of the PCB should be checked if it is missing or not.

D.The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.

E.When you solder and repair that the soldering iron, temperature must be setup 415. (The temperature range is 415±5), and the solder wire's diameter is 0.4/0.5/0.6mm (SAC 305 (1.1%)

F.Please be noticed to follow below steps for main board repair which is equipped with Golden Capacitor:

1. When replacing level 2.5 components located around the golden capacitor:

I.The temperature of the hot air blower must be under 400°c

II.When apply the hot air to the part / component, the heating time must be under 20

seconds (including the time of removing and soldering)

III.The temperature of the soldering iron must be under 350°c

IV. When apply the solder tip to the part / component, the heating time must be under 5 seconds

V. The solder tip must not contact with the golden capacitor

2.For BGA replacement: The golden capacitor must be removed before perform pre-heating, heating, soldering and de-soldering process, and then it must be replaced with a new one (please refer to 1.c. and 1.d. steps)

3.For main board which failed to pass the function test, the golden capacitor must be replaced with a new one and must follow below soldering criteria: The temperature of the soldering iron must be under 350°c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not have a contact with the body of golden capacitor

HTC CONFIDENTIAL

SM-TP001-0704

Image 103
Contents Diamond Revision Control Table REV Date Contents Table of Contents Introduction Memory Product FeaturesGPS Qualcomm Based solution FM Radio Stylus Compatibility Test EZ SIP ZIP Regulatory Product overview HTC Corporation HTC Corporation HTC Corporation HTC Corporation HTC Corporation Tools List Device Disassembling and Assembling ProcedureDisassembling procedure HTC Corporation Speaker HTC Corporation HTC Corporation Disconnect the FPC Cable by Using Twezeers Carefully HTC Corporation HTC Corporation HTC Corporation HTC Corporation HTC Corporation HTC Corporation +LCD Module Assembling procedure HTC Corporation HTC Corporation HTC Corporation HTC Corporation HTC Corporation Main Board and Lock with Hook HTC Corporation HTC Corporation Torque 0.5 ± 0.1KGF-CM 72H02454-00M HTC Corporation Torque 0.9 ± 0.1KGF-CM 72H02474-00M 72H02767-00M *2 Torque 0.5 ± 0.1KGF-CM 72H02668-00M 72H02474-00M Assembly Completed Download OS Image from SDO ROM upgrade thru RUU Re-flash Upgrade UtilityCheck the setting of menu Connect device to PCRUU-1 RUURUU-4 Format SD card and copy image file to SD card Rom Image upgrade thru SD cardHTC Corporation Doc. Title SD UpgradeAfter finish, press Reset button to reboot List of Diagnostic / WinCE Test Items Diagnostic ProgramUnit Repair Process Pre-load Process-2 Doc. Title Pre-load Process-1Pre-load Process-3 Pre-load Process-5 Doc. Title Pre-load Process-4Pre-load Process-6 Pre-load Process-8 Doc. Title Pre-load Process-7Pre-load Process-9 Pre-load Table Pre-load Process-10Folder Name Bluetooth Test-2 WinCE Test Bluetooth TestBluetooth Test-3 Camera Test USB TestFM Radio Test GPS TestWlan Test Audio Test-2 Audio Test-1Audio Test-3 Audio Test-5 Audio Test-4Cap Sensor Test-3 Doc. Title Audio Test-6Cap Sensor Test-1 Cap Sensor Test-2HTC Corporation Diagnostic Main Menu/Function Test Menu Test ProcedureAuto Test LED Test Stylus Detect TestROM Checksum Test Display Test BLUE/ Black pattern Display Test and RED/ Green patternDisplay Test WHITE/Color bar pattern Key Test Vibrator TestLCD Back Light Test Sensor Test Control box Main board leakage current Test ProcedureTypes Jig Equipment set upStart testing Idle current test Sleep current test Copy the Battery Rundown tool into the device Battery rundown test procedureTest Requirement Battery Rundown-2 Doc. Title Battery Rundown-1Battery Rundown-3 Battery Rundown-5 Doc. Title Battery Rundown-4Battery Rundown-6 Please replace a new batteryClasses definition of inspective area Cosmetic Inspection CriteriaDisplay inspection Step Between Mating Parts Main unit inspection.Buttons Do Not Respond Generic Troubleshooting.Main Unit Does Not Respond to Power Button .Touch Panel Does Not Respond to Screen Tap.Back Light Does Not Turn ON/OFF .Unusual Vertical / Horizontal lines or partial display.PC Connection not possible 10.No Sound from Speaker or Distorted sound .Battery Pack does not start.Battery discharges quickly even after fully charged .Battery Pack does not recharge11.No Recorded Sound or Distorted sound 12.Wireless connection WLAN/BT not functioning12.GPS not functioning 12.Internal storage device not functioning Agency labelDIAM100 Generic Labeling PlanDescription Agency labelDIAM110 Agency labelDIAM120 Agency labelDIAM130 Agency labelDIAM140 Agency labelDIAM300 Unit label location explanation Standard battery 900mAhLi-ionEnglish version Battery labelStandard battery 900mAhLi-ion Polymer Desay English version SPL for Repair Generic Spare Part List and PhotosHTC Corporation HTC Corporation HTC Corporation 100 101 102 Board Level 2.5 Repairs „ Basic Repair Instructions for Component ReplacementDescription 51H40485-XXMPCBA-MAIN Board Side aMAM3 MAM7 MAM2 Location Description 51H40485-XXMPCBA-MAIN Board Side BMAM14 Wcdma Band Eirp & Sensitivity Test RF Antenna SpecificationChannel