Maxon Telecom SP210, SP200 Component Replacement, Surface mount components, Surface mount removal

Page 82

Maxon SP200/210 Radio

10.1.1 Component Replacement

Surface mount components

Surface mount components should always be replaced using a temperature controlled soldering system.

The soldering tools may be either a temperature controlled soldering iron or a temperature controlled hot-air soldering station.

A hot-air system is recommended for the removal of components on the multi-layered boards used in the radio.

With either soldering system, the component manufacturer’s recommended temperature should be maintained.

The following procedures outline the removal and replacement of surface mount components. If a hot-air soldering system is employed, see the manufacturer’s operating instructions for detailed information on the use of your system.

CAUTION: Avoid applying heat to the body of any surface mount component using standard soldering method. Heat should be applied only to the metalised terminals of the components. Hot-air systems do not damage the components since the heat is quickly and evenly distributed to the external surface of the component.

CAUTION: The CMOS integrated circuit devices used in this equipment can be destroyed by static discharges.

Before handling any of these devices, service technicians should discharge themselves by touching the case of a bench test instrument that has a 3-prong power cord connected to an outlet with a known good earth ground.

When soldering or desoldering a CMOS device, the soldering equipment should have a known good earth ground.

Surface mount removal

1.Grip the component with tweezers or sill needle nose pliers.

2.Alternately heat the metalised terminal ends of the surface mount component with the soldering iron. If a hot- air system is used, direct the heat to the terminals of the component.

10.SPARE PARTS & MAINTENANCE POLICY - Page 10-2

SP200/210

Use extreme care with the soldering equipment to prevent damage to the printed circuit board (PCB) and the surrounding components.

3.When the solder on all terminals is liquefied, gently remove the component. Excessive force may cause the PCB pads to separate from the board if all solder is not completely liquefied.

4.It may be necessary to remove excess solder using a vacuum de-soldering tool or solder wick. Again, use great care when de- soldering or soldering on the printed circuit boards.

It may be necessary to remove the epoxy adhesive that was under the surface mount component and any flux on the PCB.

Surface mount component replacement

1.“Tin” one terminal end of the new component and the corresponding pad of the PCB. Use as little solder as possible.

2.Place the component on the PCB pads, observing proper orientation for capacitors, diodes, transistors, etc.

3.Simultaneously touch the “tinned” terminal end and the “tinned” pad with the soldering iron. Slightly press the component down on the board as the solder liquefies.

Solder all terminals, allowing the component time to cool between each

application of heat.

Do not apply heat for an excessive length of time and do not use excessive solder.

With a hot-air system, apply hot air until all “tinned” areas are melted and the component is seated in place. It may be necessary to slightly press the component down on the board.

Touch-up the soldered connections with a standard soldering iron as needed. Do not use excessive solder.

CAUTION: Some chemicals may damage the internal and external plastic parts of the radio.

4.Allow the component and the board to cool and then remove all flux from the area using alcohol or another approved flux remover.

Issue 1.0 03/01

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Contents SP200/210 NSW Australia Tel +61 0 2 9707 Amendment Record Sheet Issue No Effective Date Reason for Change SignatureAmendment Record Sheet Maxon SP200/210 Radio Table of Contents 10-1 SL100 UHF Parts List11.4 Default Settings 11-8 11-1List of Tables Maxon SP200/210 Radio Issue 03/01 Amendments to this Manual Using this ManualIntroduction Category C Engineering BulletinContact Information Specifications GeneralVibration Environmental Operating Temperature RangePhysical Dimensions Synthesiser ESD EMCPre-Install Check Accessories Accessories & OptionsOptions Accessories & Options INSTALLATION, Commissioning & Alignment INSTALLATION, Commissioning & AlignmentInstallation ConnectionsCommissioning Recommended Test EquipmentCommissioning Equipment Commissioning KitTest Equipment Set-up using Discrete Test Equipment Discrete Test EquipmentSK 3100 Service Kit Transmitter Performance Tests Test Equipment ConnectionReceiver Performance Tests Squelch Power AdjustmentAudio Output Preparation Tests without DisassemblyAlignment VHFRemoving and Replacing Battery Disassembly and Re-assembly of the RadioRemoving and Replacing the Belt Clip Location of Adjustment Points Removing and Replacing the Main AssemblyPLL Alignment Transmitter Alignment Squelch SensitivityTcxo Radiocommunications Test SET Audio deviation adjustment Balance AdjustmentCtcss / DCS deviation At maximum volume, nominal distortion is 10% Audio Volume LevelReceiver Alignment Common Circuits Detailed Functional DescriptionIntroduction EepromAudio Signal Path Audio AsicSat Signal Path Miscellaneous Signals and ControllerAudio/SAT Circuits Common RF Circuits Battery Low Indicator CircuitLEDs and indicators PLL SynthesiserCharge Pump and Loop Filter PLL ICOut-of-Lock Detector DC to DC ConverterTransmitter Antenna SwitchAutomatic power control APC circuits PA moduleReceiver Front EndSquelch Mute Circuit First MixerSecond mixer, Second IF, FM detector 16kHz Band Pass FilterAF Output Low Pass Filter Noise detector circuitSpeaker Audio Amplifier Diagnostics TroubleshootingDiagnostic Function TroubleshootingTroubleshooting Chart If ICTransistors Main Circuit Voltage ChartsMain Circuit Transistor Voltages Integrated Circuit Voltages Receive Integrated CircuitsIntegrated Circuit Voltages Transmit Troubleshooting Troubleshooting Troubleshooting Troubleshooting Introduction ProgrammingSMP6100 Getting StartedProgram/Print/Save Select Features MenuScanning Program RadioPrint Data Save Data to DiskMaxon SP200/200 Radio SP200/210 Exploded Mechanical Drawings & Parts Lists Exploded Mechanical Drawings & Parts ListsParts List Spare PartsSL100U2 SL100V2Mechanical Parts For details on servicing, please refer to SectionParts List for Exploded Mechanical Drawing LCD TTR 1866 DpfdpwSML-020MLTT86 SMD PCB LCDSKPT-110VA NUT M7 BsbmPCB VCO PCB RF Aldc Bsbm M2.6V2 Control Circuit SL100 VHF Parts List05B-000-5Z Chip Ceramic 0.012UF GRM39 X7R123K 25V P Diode Switching KDS181S A3Chip Ceramic 0.001UF GRM39 X7R102K 50V P Chip Ceramic 0.0022UF GRM39 X7R222J 50V P2 V2 RF SW Tact SKPT-1101VAThermistor Chip 33KNTCCS32163SH333KC TH1 RES.CHIP Trimmer 1K RH03E1C13XRES.CHIP Trimmer 10K RH03E1C14X Elect Capacitor 10UF 16V 20%Chip Ceramic 43PF GRM40 COG430J 50V P RE Power Module GNOK-M68776-E01 IC9Chip Ceramic 39PF GRM40 COG390J 50V P Chip Ceramic 47PF GRM39 COG470J 50V PTcxo Assembly 4 V2 VCO 5 V2 Front EndSL100 UHF Parts List U2 Control CircuitConnector Waffer Chip Resistor 18K 2 U2 RFChip Resistor 12K Chip Resistor 39KChip Ceramic 10PF GRM40 COG100C 50V P RES.CHIP Trimmer K RH03E1C13XChip Ceramic 0.0015UF GRM39 X7R152K 50V P Chip CeramicChip Ceramic 470PF GRM40 COG471J 50V P Power Mpduleuhf M68732HGNOK IC9Chip Ceramic 2.2PF GRM40 COG2R2C 50V P Chip Ceramic 4.7PF GRM40 COG4R7C 50V PCoil Spring X0.35X7TR TcxoCoil Chip 18NHLL2012-F18NM Coil Spring 2X0.75X3TL SMD4 VCO Maxon SP200/210 Radio RF PCB Circuit Diagrams & PCB LayoutsCircuit Diagrams & PCB Layouts TcxoCircuit Diagrams & PCB Layouts Digital Board Layout Top Side Digital Board Layout Bottom Side RF Board Layout Top Side Issue RF Board Layout Bottom Side P406787a Front End Front-End Board Layout Tcxo Board Layout 10SPARE Parts Spare Parts & Maintenance Policy10.1Spare Parts Surface mount components Component ReplacementSurface mount component replacement Surface mount removalSurface mounted integrated circuit replacement Spare Parts & Maintenance Policy 11.2Test Equipment 11APPENDIX ACC-2003 Alignment BOX11.1Purpose 11.3Calibration ProgramCalibration Program Primary Screen Appendix a ACC-2003 Alignment BOXAsic Control Screen Rx TXTRIM2 Adjustment of Asic valuesTXTRIM3 RX VOL SAT Balance Transmit AdjustmentsSAT Deviation Receive Adjustments Audio Output LevelV1 Default Frequency Table 11.4Default Settings11.4.1 V1 Band Default Settings V1 Default Asic SettingsV2 Default Frequency Table 11.4.2 V2 Band Default SettingsV2 Default Asic Settings U1 Default Frequency Table 11.4.3 U1 Band Default SettingsU1 Default Asic Settings U2 Default Frequency Table 11.4.4 U2 Band Default SettingsU2 Default Asic Settings
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