Product Description

LOCTITE® 3609™ provides the following product characteristics:

Technology	Epoxy
Chemical Type	Epoxy
Appearance (uncured)	Dark, red viscous gelLMS
Components	One component - requires no mixing
Cure	Heat cure
Application	Surface mount adhesive
Key Substrates	SMD components to PCB
Other Application Areas	Small parts bonding
Dispense Method	Syringe
Dispense Speed	Medium 15,000 -25,000 dots/h
Wet Strength	High

LOCTITE® 3609™ is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. LOCTITE® 3609™ has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C	1.2
Particle Size, µm	<150
Flash Point - See MSDS
Yield Point, 25 °C, Pa	250 to 700LMS
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
Casson Viscosity @ 25 °C, Pa∙s	0.16 to 2.0
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone

VISCOSITY VS. TEMPERATURE

The following graph shows a typical temperature-viscosity curve as measured using a Haake rotoviscometer PK100, M10/PK1 2° Cone system at a shear rate of 2 s-1which is representative of the shear rate in the dispense nozzle. Increased cabin or nozzle temperature in the 30°C to 35°C range may aid dispense performance at higher dispense speeds.

Technical Data Sheet

LOCTITE® 3609™

March 2008

Pa∙s	400
	400
	300
	300

Viscosity,	200
	200
	100
	100
	0
	20	25		30	35
			Temperature, °C

TYPICAL CURING PERFORMANCE

Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at the cure temperature.

Cure Speed vs. Time, Temperature

The following graph shows the rate of torque strength developed with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow for heat up period. Strength is measured on 1206 capacitors @ 22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.

	100
	100		150°C				125°C
			150°C
Strength												100°C
	75											100°C


ofFull	50
	50
	25
%	25
%
	0
	0	1		2		3		4	5	6	7		8	9	10
					Time at			Temperature, minutes
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 30 minutes @ 150 °C
Physical Properties:
	Coefficient of Thermal Expansion,													145×10-6
	ISO 11359-2, K-1
	Coefficient of Thermal Conductivity, ISO 8302,													0.4
	W/(m·K)
	Glass Transition Temperature, ASTM D 4065, °C													73
	Specific Heat, kJ/(kg·K)													0.3
	Density, BS 5350-B1 @ 25 °C, g/cm³													1.4

3609TM specifications

Henkel 3609TM is a cutting-edge adhesive technology designed to meet the rigorous demands of modern industries, particularly in the automotive, electronics, and consumer goods sectors. This advanced product showcases a unique blend of high-performance attributes, making it a go-to solution for manufacturers looking to enhance their assembly processes and product durability.

One of the standout features of Henkel 3609TM is its exceptional bond strength. The adhesive forms strong, durable connections between various substrates, including metals, plastics, and composites. This versatility allows manufacturers to streamline operations by using a single product for multiple applications, reducing inventory complexity and costs.

Henkel 3609TM incorporates innovative bonding technologies that allow it to achieve rapid curing times. This acceleration in cure speed results in improved production efficiency, enabling manufacturers to increase throughput without compromising on bond quality. The adhesive can perform well in both ambient and elevated temperature conditions, making it suitable for diverse operational environments.

Another defining characteristic of Henkel 3609TM is its resistance to environmental factors. The adhesive exhibits outstanding resistance to moisture, chemicals, and thermal variations, which is essential for products exposed to harsh conditions. This durability not only extends the lifespan of bonded products but also enhances their overall reliability and performance.

Henkel has also prioritized user-friendliness in the design of 3609TM. The adhesive is easy to apply, whether through automated dispensing systems or manual application. The simplicity of use combined with the high performance means that employees can adopt this adhesive technology with minimal training, fostering a more efficient production process.

In addition, Henkel 3609TM is backed by extensive technical support and expertise. The company provides comprehensive guidance on product selection, application methods, and material compatibility, ensuring that customers can maximize the benefits of this advanced adhesive solution.

Overall, Henkel 3609TM represents a significant advancement in adhesive technology. Its unique combination of high bond strength, rapid curing, environmental resistance, and user-friendly application makes it an ideal choice for manufacturers aiming to innovate and improve their product offerings. With Henkel's commitment to quality and performance, 3609TM is poised to be a transformative solution for a wide range of industries.