HP 110c-1040DX, 110c-1048NR, 110c-1001NR manual Heat sink assembly

Heat sink assembly

Description	Spare part number
Heat sink assembly (includes replacement thermal material)	537619-001

Before removing the heat sink assembly, follow these steps:

1.Shut down the device. If you are unsure whether the device is off or in Hibernation, turn the device on, and then shut it down through the operating system.

2.Disconnect all external devices connected to the device.

3.Disconnect the power from the device by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the device.

4.Remove the battery (see Battery on page 36).

5.If your device has WWAN capability, remove the SIM (see SIM on page 37.

6.Remove the following components:

a.Keyboard (see Keyboard on page 40)

b.Hard drive or solid-state drive (see Mass storage devices on page 45)

c.Top cover (see Top cover on page 48)

d.WLAN module (see WLAN module on page 51)

e.Fan (see Fan on page 57)

Remove the heat sink assembly:

1.Remove the 4 Phillips SP1.5×1.05 screws (1) that secure the heat sink assembly to the system board.

NOTE: The screws are numbered 1 through 4. Follow this order when removing the screws.

Component replacement procedures 59