HP 110c-1001NR, 110c-1048NR, 110c-1040DX manual Solid-state drive specifications

Page 86

Solid-state drive specifications

Performance

Transfer modes supported

UDMA 0-4, Multiword-DMA 0-2, PIO 0-4

 

 

Sustained read

39 MB/sec

 

 

Sustained write

17 MB/sec

 

 

Characteristics

 

 

 

Interface

Parallel ATA (PATA)

 

 

MLC NAND flash capacity

8 GB, 16 GB

 

 

Electrical specifications

 

 

 

DC supply voltage

3.3 V +/– 5%

 

 

Standby current

300 µA (typical)

 

 

Active current

Read = 130 mA (typical)

 

Write = 120 mA (typical)

 

 

Environmental specifications

 

 

 

Operating temperature

0°C to +70°C (32°F to 158°F)

 

 

Storage temperature

-25°C to +85°C (-13°F to 185°F)

 

 

Operating altitude

up to 24,384 m (80,000 feet)

 

 

Humidity

5% to 90% non-condensing

 

 

Shock

1,000 g

 

 

Acoustic noise

0 dB

 

 

Vibration

15 g (peak to peak)

 

 

Physical specifications

 

 

 

Connector

40-pin ZIF connector

 

 

Weight (8-GB model)

5.5 g

 

 

Weight (16-GB model)

7.0 g

 

 

Dimensions (8-GB model)

54 × 32 × 2.6 mm

 

 

Dimensions (16-GB model)

54 × 32 × 3.75 mm

 

 

Regulations and compliance

RoHS, China RoHS, SGS ROHS, FCC, CE

 

UL – PCB Only

 

 

78 Chapter 6 Specifications

Image 86
Contents HP Mini 1101 Notebook PC, HP Mini 110, and Compaq Mini First Edition May Document Part Number Safety warning notice Iv Safety warning notice Table of contents Setup Utility Screw listing Recycling Product description Devices Category Description HP Mini Compaq MiniMass storage Optical driveExternal media Category Description HP Mini Compaq Mini WirelessPower CardsCategory Description HP Mini Compaq Mini Security Operating system PreinstalledServiceability End-user replaceable parts TouchPad External component identificationTop components Component DescriptionLight Component Description Caps lock light On Caps lock is onKeys Fn keyExecutes frequently used system functions when pressed Front components Front componentsExternal component identification Right-side components Left-side components Display components Bottom components Wireless antennas Service tag Illustrated parts catalogDevice major components Description Spare part numberKeyboard Mass storage devices Power/battery pass-through boardWireless modules Wlan module FanWwan module RTC batteryBattery Display assembly components Display enclosure includes logo Display Screw Kit not illustratedMass storage devices Item Description Spare part numberMiscellaneous parts Bluetooth adapterPower cords Description Spare part number UMA AC adapterSequential part number listing Spare part Description NumberIllustrated parts catalog FSB, and replacement thermal material Models only Service considerations Removal and replacement proceduresPreliminary replacement requirements Tools requiredDrive handling Event 10% 40% 55% Grounding guidelinesTypical electrostatic voltage levels Packaging and transporting guidelines Equipment guidelines Material Use Voltage protection levelComponent replacement procedures Service tagDevice feet Description Spare part number Rubber Kit 537618-001Battery SIM Memory module Page For use only on models with Mobile Mi installed KeyboardDescription Spare part number Page Page RTC battery Description Spare part number RTC battery 537616-001Solid-state drive Mass storage devicesDescription Spare part number Hard drive select models only Hard drive Page Top cover Page Page Wlan module Top cover see Top cover onPage Wwan module Page USB/audio board Power/battery pass-through board Fan Description Spare part number Fan 537613-001Page Heat sink assembly Page System board Page Page Display assembly Keyboard see Keyboard on Page Page Page Page Page Using the Setup Utility Setup UtilityStarting the Setup Utility Changing the language of the Setup UtilityDisplaying system information Restoring default settings in the Setup UtilityExiting the Setup Utility Main menu Setup Utility menusSystem Configuration menu Security menuDiagnostics menu Specifications Device specificationsInch, AntiGlare display specifications Hard drive specifications Solid-state drive specifications System DMA specifications Hardware DMA System functionSystem interrupt specifications Hardware IRQ System functionSystem I/O address specifications Address hex System function shipping configurationFFA0 Ffaf System memory map specifications Memory address System functionColor Quantity Length Thread Head diameter Silver Screw listingPhillips PM1.5×1.0 screw Page Phillips PM2.0×3.0 screw Color Quantity Length Thread Head diameter BlackPage Phillips PM2.0×3.0 captive screw Phillips PM2.0×4.0 screw Phillips PM2.0×5.0 screw Phillips PM2.5×5.0 screw Page Phillips PM2.5×7.0 screw Phillips PM2.5×10.0 captive screw Color Quantity Length Thread Head diameter Black 10.0 mmPhillips PM3.0×40.0 screw Backup and recovery Restoring your information Mobile Mi backup and recoveryBacking up your information Using System Restore Restoring using a Linux computer Select Download restore image/HP Mi Restore Image Windows Vista backup and recovery Performing a recovery Using the Windows recovery tools Using f11 Windows XP backup and recovery Recovering your information Audio-in microphone Connector pin assignmentsPin Signal Audio-out headphone External monitor RJ-45 network Universal Serial Bus Power cord set requirements Requirements for all countries and regionsRequirements for specific countries and regions Country/region Accredited agency Applicable note numberDisplay BatteryRecycling Page Page Page Page Page Index Jacks SIM Wwan module removal Spare part number Index
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