HP 110c-1048NR Grounding guidelines, Typical electrostatic voltage levels, Event 10% 40% 55%

Page 39

Grounding guidelines

Electrostatic discharge damage

Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.

A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.

An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life expectancy.

CAUTION: To prevent damage to the device when you are removing or installing internal components, observe these precautions:

Keep components in their electrostatic-safe containers until you are ready to install them.

Use nonmagnetic tools.

Before touching an electronic component, discharge static electricity by using the guidelines described in this section.

Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.

If you remove a component, place it in an electrostatic-safe container.

The following table shows how humidity affects the electrostatic voltage levels generated by different activities.

CAUTION: A product can be degraded by as little as 700 V.

Typical electrostatic voltage levels

 

 

Relative humidity

 

 

 

 

 

Event

10%

40%

55%

 

 

 

 

Walking across carpet

35,000 V

15,000 V

7,500 V

 

 

 

 

Walking across vinyl floor

12,000 V

5,000 V

3,000 V

 

 

 

 

Motions of bench worker

6,000 V

800 V

400 V

 

 

 

 

Removing DIPS from plastic tube

2,000 V

700 V

400 V

 

 

 

 

Removing DIPS from vinyl tray

11,500 V

4,000 V

2,000 V

 

 

 

 

Removing DIPS from Styrofoam

14,500 V

5,000 V

3,500 V

 

 

 

 

Removing bubble pack from PCB

26,500 V

20,000 V

7,000 V

 

 

 

 

Packing PCBs in foam-lined box

21,000 V

11,000 V

5,000 V

 

 

 

 

Preliminary replacement requirements 31

Image 39
Contents HP Mini 1101 Notebook PC, HP Mini 110, and Compaq Mini First Edition May Document Part Number Safety warning notice Iv Safety warning notice Table of contents Setup Utility Screw listing Recycling Product description Optical drive Category Description HP Mini Compaq MiniMass storage DevicesCards Category Description HP Mini Compaq Mini WirelessPower External mediaOperating system Preinstalled Serviceability End-user replaceable partsCategory Description HP Mini Compaq Mini Security Component Description External component identificationTop components TouchPadComponent Description Caps lock light On Caps lock is on LightFn key KeysExecutes frequently used system functions when pressed Front components Front componentsExternal component identification Right-side components Left-side components Display components Bottom components Wireless antennas Illustrated parts catalog Service tagDescription Spare part number Device major componentsKeyboard Fan Power/battery pass-through boardWireless modules Wlan module Mass storage devicesRTC battery BatteryWwan module Display assembly components Display Screw Kit not illustrated Display enclosure includes logoItem Description Spare part number Mass storage devicesDescription Spare part number UMA AC adapter Bluetooth adapterPower cords Miscellaneous partsSpare part Description Number Sequential part number listingIllustrated parts catalog FSB, and replacement thermal material Models only Tools required Removal and replacement proceduresPreliminary replacement requirements Service considerationsDrive handling Grounding guidelines Typical electrostatic voltage levelsEvent 10% 40% 55% Packaging and transporting guidelines Material Use Voltage protection level Equipment guidelinesService tag Component replacement proceduresDescription Spare part number Rubber Kit 537618-001 Device feetBattery SIM Memory module Page Keyboard For use only on models with Mobile Mi installedDescription Spare part number Page Page Description Spare part number RTC battery 537616-001 RTC batteryMass storage devices Description Spare part number Hard drive select models onlySolid-state drive Hard drive Page Top cover Page Page Top cover see Top cover on Wlan modulePage Wwan module Page USB/audio board Power/battery pass-through board Description Spare part number Fan 537613-001 FanPage Heat sink assembly Page System board Page Page Display assembly Keyboard see Keyboard on Page Page Page Page Page Changing the language of the Setup Utility Setup UtilityStarting the Setup Utility Using the Setup UtilityRestoring default settings in the Setup Utility Exiting the Setup UtilityDisplaying system information Security menu Setup Utility menusSystem Configuration menu Main menuDiagnostics menu Device specifications SpecificationsInch, AntiGlare display specifications Hard drive specifications Solid-state drive specifications Hardware DMA System function System DMA specificationsHardware IRQ System function System interrupt specificationsAddress hex System function shipping configuration System I/O address specificationsFFA0 Ffaf Memory address System function System memory map specificationsScrew listing Phillips PM1.5×1.0 screwColor Quantity Length Thread Head diameter Silver Page Color Quantity Length Thread Head diameter Black Phillips PM2.0×3.0 screwPage Phillips PM2.0×3.0 captive screw Phillips PM2.0×4.0 screw Phillips PM2.0×5.0 screw Phillips PM2.5×5.0 screw Page Phillips PM2.5×7.0 screw Color Quantity Length Thread Head diameter Black 10.0 mm Phillips PM2.5×10.0 captive screwPhillips PM3.0×40.0 screw Backup and recovery Mobile Mi backup and recovery Backing up your informationRestoring your information Using System Restore Restoring using a Linux computer Select Download restore image/HP Mi Restore Image Windows Vista backup and recovery Performing a recovery Using the Windows recovery tools Using f11 Windows XP backup and recovery Recovering your information Connector pin assignments Pin SignalAudio-in microphone Audio-out headphone External monitor RJ-45 network Universal Serial Bus Requirements for all countries and regions Power cord set requirementsCountry/region Accredited agency Applicable note number Requirements for specific countries and regionsBattery RecyclingDisplay Page Page Page Page Page Index Jacks SIM Wwan module removal Spare part number Index
Related manuals
Manual 83 pages 37.66 Kb Manual 8 pages 26.72 Kb