HP 511 manual Sequence1 2

Page 11

Working Instruction

Document No. : SOP VV09 FA DIS-ASS’Y				Station :	7(1/1)
Name :	Disassemble SW/C	Ver. :	1.00	Date :	2009/05/18

Fig.1

			1. Disassemble SW/C , Fig.1 g.1
	①		14” : 6070B0350501
②	①	②	15” : 6070B0351101
		②	Sequence:123
			Sequence:123
	3		2. Turn over the K/B , Fig.2
	3

Fig.2

Point for attention： If finding some defects, notice the gaffer and assistant

Fixture list（Fixture standard）

Qty

Fixture list（Fixture standard）

Qty

Zhang Ying	Issuing department： IE
Tabulator：_________

Image 11

Contents Product End-of-Life Disassembly Instructions Tool Size if applicable Manufacturing Process Instructions Mechanical Assembly Working Instruction Fig图二.2 Loosen screws 6052B0096201 of SW cover Screws cant be stripped or dropped into machine Wlan Card Loosen screws 6052B0097001 of ODD。 14 Loosen screws *2， Loosen screws of Btcb 6052A0021901 Sequence1 2 2009/05/18 Working Instruction 15’ Working Instruction Loosen screws of LCM 6052B0098201 * 4。 15’ Document No. SOP VV09 FA DIS-ASS’Y Station 131/1 Name Disassemble Tpcb Touch PAD FFC from M/BFig.2。 Loosen screws of Bluetooth For 15 only Document No. SOP VV09 FA DIS-ASS’Y Station 171/1 Name Loosen screws of FAN 6052A0003501 * 2。 Intel discrete Good Tape of acetic acid Take down 15 ODD extension board Gasket AMD DIS AMD UMA Intel UMA Fig图.一1 Modem LCM Cntr