HP 511 manual Tool Size if applicable

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description

Description #1 Motor-screw-driver “+”

Description #2 Motor-screw-driver “*”

Description #3 Motor-screw-driver “-”

Tool Size (if applicable)

Cross head of screwdriver

TORX T8 (2.31mm)

3.0Product Disassembly Process

3.1List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1.Follow steps described in Disassembly instruction (file attached).

2.If parts can be removed without using a tool, remove it first.

3.Use correct screwdriver and torque value before unlock the screw.

5..

3.2Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00

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Template Revision A

 

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Contents Product End-of-Life Disassembly Instructions Tool Size if applicable Manufacturing Process Instructions Mechanical Assembly Working Instruction Fig图二.2 Loosen screws 6052B0096201 of SW cover Screws cant be stripped or dropped into machine Wlan Card Loosen screws 6052B0097001 of ODD。 14 Loosen screws *2, Loosen screws of Btcb 6052A0021901 Sequence1 2 2009/05/18 Working Instruction 15’ Working Instruction Loosen screws of LCM 6052B0098201 * 4。 15’ Document No. SOP VV09 FA DIS-ASS’Y Station 131/1 Name Disassemble Tpcb Touch PAD FFC from M/BFig.2。 Loosen screws of Bluetooth For 15 only Document No. SOP VV09 FA DIS-ASS’Y Station 171/1 Name Loosen screws of FAN 6052A0003501 * 2。 Intel discrete Good Tape of acetic acid Take down 15 ODD extension board Gasket AMD DIS AMD UMA Intel UMA Fig图.一1 Modem LCM Cntr