Texas Instruments SLOU082 manual TPA032D03 Class-D EVM Bill of Materials

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TPA032D03 Class-D EVM Bill of Materials

3.8 TPA032D03 Class-D EVM Bill of Materials

The components in the bill of materials (Table 3±4) were selected for their common values, availability, and the smallest size available to meet these criteria.

Table 3±4. TPA032D03 Class-D EVM Bill of Materials

Reference

Description

Size

EVM

Manufacturer/

Qty.

Part Number

 

 

 

 

 

 

 

 

C1, C2, C15

Capacitor, Ceramic Chip, 0.1 F, ±10%,

0805

3

Kemet

 

50 V, X7R

 

 

C0805C104J5RAC

 

 

 

 

 

C3, C4, C7, C8,

Capacitor, Ceramic Chip, 1 F, ±10%,

1206

8

Kemet

C9, C12, C13,

25 V, X7R

 

 

C1206C105K3RAC

C23

 

 

 

 

 

 

 

 

 

C16

Capacitor, Ceramic Chip, 0.047 F, ±10%,

0805

1

Kemet

 

50 V, X7R

 

 

C0805V473K5RAC

 

 

 

 

 

C17, C18

Capacitor, Ceramic Chip, 5.6 pF, ±5%,

0603

2

Kemet

 

50 V, C0G,

 

 

C0603C569J5GAC

 

 

 

 

 

C5, C6

Capacitor, Ceramic Chip, 1 nF, ±5%,

0805

2

Kemet

 

50 V, C0G,

 

 

C0805C102J5GAC

 

 

 

 

 

C10

Capacitor, Ceramic Chip, 10 F, +80%±20%,

1210

1

muRata

 

25 V, Y5V

 

 

GRM235Y5V106Z25

 

 

 

 

 

C19, C20

Capacitor, Aluminum Electrolytic, Radial Lead,

0.197º

2

Panasonic

 

33 F, ±20%, 35 V, FC Series, 80 mΩ @ 100

0.0197º

 

EEUFC1V333

 

kHz, 175 ma Ripple, ±55°C to +105°C

0.078º

 

 

 

 

 

 

 

C21, C22

Capacitor, Ceramic Chip, 0.22 F, ±10%,

1206

2

Kemet

 

50 V, X7R

 

 

C1206C224K5RAC

 

 

 

 

 

C11²

Not assembled

0.492º

1

 

 

 

0.0236º

 

 

 

 

0.197º

 

 

 

 

 

 

 

L1, L2

Inductor, SMT, 15 H, ±20%, 2.2 ADC, 47.2 mΩ

0.398º 0.398º

2

TDK

 

@ 1 kHz, ±20 to +90°C

0.236º

 

SLF10145T±150M2R2

 

 

 

 

 

R1 ± R7, R10

Resistor, Thick Film Chip, SMD, 100 kΩ, ±5%,

0603

8

Vishay/Dale

 

1/10 W, 100 V, ±50 to 150°C, ±200 ppm/°C

 

 

CRCW0603104J

 

 

 

 

 

R8, R9

Resistor, Thick Film Chip, SMD, 1 kΩ, ±5%, 1/10

0603

2

Vishay/Dale

 

W, 100 V, ±50 to 150°C, ±200 ppm/°C

 

 

CRCW0603101J

 

 

 

 

 

R13

Resistor, Thick Film Chip, SMD, 500 kΩ, ±5%,

0603

1

Vishay/Dale

 

1/10 W, 100 V, ±50 to 150°C, ±200 ppm/°C

 

 

CRCW0603504J

 

 

 

 

 

R14

Resistor, Thick Film Chip, SMD, 150 kΩ, ±5%,

0603

1

Vishay/Dale

 

1/10 W, 100 V, ±50 to 150°C, ±200 ppm/°C

 

 

CRCW0603154J

 

 

 

 

 

TP1 ± TP3

Test Points, Red

 

3

Farnell

 

 

 

 

240±345

 

 

 

 

 

J1

Mini Phone Jack, 3.5 mm, N/C, Stereo

0.512º 0.472º

1

Mouser 161±3504

 

 

 

 

 

 

Header Pins, Gold, Single, 0.5º Long, 0.25º

0.5º, 0.25º,

16

Samtec

 

Wide, 0.100º centers

0.1º

 

TSW±19±8±G±S

 

 

 

 

 

S1, S2

Switch, Momentary, Push Button, 12 VDC,

0.291º 0.138º

2

Panasonic

 

50 mA

0.134º

 

EVQ-PJS04K

 

 

 

 

 

U1

IC, Audio Amplifier, Class-D,

TSSOP48

1

TI

 

10 W, 48 pin, DCA pkg

 

 

TPA032D03DCA

 

 

 

 

 

²Capacitor C11 is optional (not assembled) and a location for it on the EVM PCB has been provided to increase design flexibility and allow decoupling capacitance to be added.

Details 3-9

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Contents Users Guide Important Notice Related Documentation From Texas Instruments PrefacePage Contents Tables FiguresIntroduction Feature Highlights Description Typical TPA032D03 Class-D EVM SpecificationsMaximum JP1 JP2 JP3 JP4 JP5 JP6 JP7 JP8 Quick StartAudio Power PrecautionsPlatform Preparations Quick Start List for PlatformQuick Start List for Stand-Alone Details ±1. The TI Plug-N-Play Audio Amplifier Evaluation Platform Plug-N-Play Platform Power Requirements and Connections Outputs Plug-N-Play Platform Inputs and OutputsInputs TPA032D03 Class-D EVM Test Points Control and Indicator Circuits 3 J1 Ð Headphone Jack Mode Switch Module Switches 1 S1 Ð Shutdown Switch 2 S2 Ð Mute SwitchPower Connections Using The TPA032D03 Class-D EVM Stand-AloneOutput Connections Controls and IndicatorsInput Connections ±4. TPA032D03 Class-D EVM Bill of Materials TPA032D03 Class-D EVM Bill of MaterialsTPA032D03 class-D EVM schematic is shown in ±4 TPA032D03 Class-D EVM Schematic10 TPA032D03 Class-D EVM PCB Layers ±5. TPA032D03 Class-D EVM Top Assembly±7. TPA032D03 Class-D EVM Top Layer ±9. TPA032D03 Class-D EVM Third Layer Details