Alps Electric SCNA Series Soldering Conditions, Cautions, Small Memory Card Connectors

Small Memory Card Connectors

Soldering Conditions

Example of Reflow Soldering Condition（Reference）

1.Heating method: Double heating method with infrared heater.

2.Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）.

For	3. Temperature profile（Surface of products）.
SD Memory
Card

For			240℃(max.)
miniSD™
Card			230℃(min.)
For	)
	(˚C	200
microSD™
	Temperature
Card			180℃
For			150℃
W-SIM
For		100
Memory
Stick Micro™	Room		Time (s)
For	temperature
Memory		Pre-heating
Stick™		90±30 sec.	10 sec.(max.)
Combine Type
		Heating time	sec.

For

Compact

Flash™

For PC cards supporting CardBus

For

Express

Card™

For CMOS Camera Module

Cautions

1.When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required.

2.Avoid use of water-soluble soldering flux, since it may corrode the product.

3.Check and conform to reflow soldering requirements under actual mass production conditions.

4.PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout.

5.This product has been designed and manufactured for use in ordinary electronic equipment, such as AV equipment, electric home appliances, office machines and communication equipment. In case of using the products for highly sensitive applications such as medical, aviation, aerospace and security, the set makers shall require to include measures necessary to meet product safety requirements of such specific applications. Such measure may include additional protection circuits and redundant circuits, for example.

6.The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.

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