1.2 Specifications

Platform

- Micro ATX Form Factor

 

- Solid Capacitor for CPU power

CPU

- Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in

 

LGA1155 Package

 

- Supports Intel® Turbo Boost 2.0 Technology

 

- Supports K-Series CPU

Chipset

- Intel® H61

 

- Supports Intel® Rapid Start Technology and Smart Connect

 

Technology

Memory

- Dual Channel DDR3 Memory Technology

 

- 2 x DDR3 DIMM slots

 

- Supports DDR3 1600/1333/1066 non-ECC, un-buffered

 

memory (DDR3 1600 with Intel® Ivy Bridge CPU, DDR3

 

1333 with Intel® Sandy Bridge CPU)

 

- Max. capacity of system memory: 16GB (see CAUTION 1)

 

- Supports Intel® Extreme Memory Profile (XMP) 1.3 / 1.2 with

 

Intel® Ivy Bridge CPU

Expansion Slot

- 1 x PCI Express 3.0 x16 slot (PCIE1 @ x16 mode)

 

* PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With

 

Intel® Sandy Bridge CPU, it only supports PCIE 2.0.

 

- 1 x PCI Express 2.0 x1 slot

 

- 1 x PCI slot

Graphics

* Intel® HD Graphics Built-in Visuals and the VGA outputs can

 

be supported only with processors which are GPU

 

integrated.

 

- Supports Intel® HD Graphics Built-in Visuals: Intel® Quick

 

Sync Video 2.0, Intel® InTruTM 3D, Intel® Clear Video HD

 

Technology, Intel® InsiderTM, Intel® HD Graphics 2500/4000

 

with Intel® Ivy Bridge CPU

 

- Supports Intel® HD Graphics Built-in Visuals: Intel® Quick

 

Sync Video, Intel® InTruTM 3D, Intel® Clear Video HD

 

Technology, Intel® HD Graphics 2000/3000, Intel® Advanced

 

Vector Extensions (AVX) with Intel® Sandy Bridge CPU

 

- Pixel Shader 5.0, DirectX 11 with Intel® Ivy Bridge CPU.

 

Pixel Shader 4.1, DirectX 10.1 with Intel® Sandy Bridge

 

CPU.

 

- Max. shared memory 1760MB with Intel® Ivy Bridge CPU.

 

Max. shared memory 1759MB with Intel® Sandy Bridge

 

CPU.

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ASRock H61M-DPS manual Specifications