P8H61-M PLUS V3 specifications summary

CPU

ChipsetMemoryExpansion slotsStorageLANAudioUSBASUS unique features

LGA1155 socket for Intel® 3rd/2nd Core™ i7 / i5 / i3 / Pentium® / Celeron® processors

Supports 22nm / 32nm CPU

Supports Enhanced Intel® SpeedStep Technology (EIST)

*Refer to www.asus.com for Intel® CPU support list. Intel® H61 Express Chipset

2 x DIMM, max. 16GB**, DDR3 2200(O.C.) /2133(O.C.) /2000(O. C.) /1866(O.C.) /1800(O.C.) /1600 /1333 /1066 MHz, non-ECC, un-buffered memory

Dual-channel memory architecture

Supports Intel® Extreme Memory Profile (XMP)

*1600MHz and higher frequency is supported by Intel® 3rd generation processor.

**The maximum 16GB memory capacity can be supported with 8GB or above DIMMs. ASUS will update the memory QVL once the DIMMs are available in the market.

***Refer to www.asus.com for the latest Memory QVL (Qualified

Vendors List).

****When you install a total memory of 4GB capacity or more, Windows® 32-bit operating system may only recognize less than 3GB. We recommend a maximum of 3GB system memory if you are using a Windows® 32-bit operating system.

1 x PCI Express 3.0/2.0 x16 slot

1 x PCI Express 2.0 x1 slots

2 x PCI slots

Intel® H61 Express Chipset:

-4 x Serial ATA 3.0 Gb/s connectors Realtek® 8111E PCIe Gigabit LAN controller

Realtek® ALC887 8-channel* High Definition Audio CODEC

*Use a chassis with HD audio module in the front panel to support an 8-channel audio output.

Intel® H61 Express Chipset:

-8 x USB 2.0/1.1 ports (4 ports at the mid-board, 4 ports at the back panel)

ASUS ESD Guard

ASUS GPU Boost

ASUS Anti-Surge Protection

ASUS UEFI BIOS

ASUS CrashFree BIOS 3

ASUS EZ Flash 2

ASUS MyLogo 2™

100% All High-quality Conductive Polymer Capacitors

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