P8H61-M LX3 R2.0 Series specifications summary
CPU

LGA1155 socket for Intel® 3rd/2nd Generation Core™ i7 / Core™

 

i5 / Core™ i3 / Pentium® / Celeron® processors

 

Supports Intel 22nm CPU

 

Supports Intel® Turbo Boost Technology 2.0

 

* The Intel® Turbo Boost Technology 2.0 support depends on the

 

CPU types.

Chipset

** Refer to www.asus.com for Intel® CPU support list.

Intel® H61 Express Chipset

 

Memory

2 x DIMMs, max. 16GB, DDR3 2200 (O.C.) / 2133 (O.C.) / 2000

 

 

(O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz, non-ECC, un-

 

buffered memory

 

Dual-channel memory architecture

 

* DDR3 1600 MHz and higher memory frequency is supported by

 

Intel® 3rd generation processors.

 

** Refer to www.asus.com for the latest Memory QVL (Qualified

 

Vendors List).

 

***When you install a total memory of 4GB capacity or more,

 

Windows® 32-bit operating system may only recognize less than

 

3GB. We recommend a maximum of 3GB system memory if you

Expansion slots

are using a Windows® 32-bit operating system.

1 x PCI Express 3.0*/2.0 x16 slot with latch

 

 

2 x PCI Express 2.0 x1 slots

 

* PCIe 3.0 speed is supported by Intel® 3rd generation Core™

Graphics

processors.

Supports D-Sub with max. resolution of 2048 x 1536 @75Hz

 

Storage

Max. UMA Memory: 1748MB

 

Intel® H61 Express Chipset:

 

- 4 x Serial ATA 3.0 Gb/s connectors

LANAudioUSBOther features

Realtek® 8111F PCIe Gigabit LAN controller

VIA® VT1708S 8-channel* High Definition Audio CODEC

- Supports Multi-Streaming

* Use a chassis with HD audio module in the front panel to support an 8-channel audio output.

10 x USB 2.0/1.1 ports (6 ports at the mid-board, 4 ports at the back panel)

100% All High-quality Conductive Polymer Capacitors (P8H61-M LX3 PLUS R2.0 only)

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