MoBL®, CY62126EV30
Document #: 38-05486 Rev. *E Page 4 of 13
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions VFBGA
Package
TSOP II
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 4.25 x 1.125 inch,
two-layer printed circuit board
58.85 28.2 °C/W
ΘJC Thermal Resistance
(Junction to Case)
17.01 3.4 °C/W
Figure 3. AC Test Loads and Waveforms
Parameters 2.2V - 2.7V 2.7V - 3.6V Unit
R1 16600 1103 Ohms
R2 15400 1554 Ohms
RTH 8000 645 Ohms
VTH 1.2 1.75 Volts
Data Retention Characteristics
Over the Operating Range
Parameter Description Conditions Min Typ[1] Max Unit
VDR VCC for Data Retention 1.5 V
ICCDR[7] Data Retention Current VCC= VDR, CE > VCC – 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
Industrial 3 μA
Automotive 30 μA
tCDR[8] Chip Deselect to Data
Retention Time 0ns
tR[9] Operation Recovery Time tRC ns
Figure 4. Data Retention Waveform
VCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10% 90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT VTH
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
VCC(min)
VCC(min)
tCDR
VDR>1.5V
DATA RETENTION MODE
tR
VCC
CE
Notes
8. Tested initially and after any design or process changes that may affect these parameters.
9. Full device AC operation requires linear VCC ramp from VDR to VCC(min) > 100 μs.
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