CY62147DV18
MoBL2™
Electrical Characteristics Over the Operating Range (continued)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||||||
Parameter |
|
| Description |
|
|
|
| Test Conditions |
|
| Min. | Typ.[7] |
| Max. | Min. | Typ.[7] |
| Max. |
| Unit | ||||||||
ISB1 |
| Automatic CE |
|
| CE |
| > VCC−0.2V, | VCC(max)=1.95V | L |
|
| 0.5 |
| 12 |
| 0.5 |
| 12 |
|
| ∝A | |||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||
|
|
|
|
|
|
| LL |
|
|
|
| 8 |
|
|
| 8 |
|
|
| |||||||||
|
| Current — |
|
| VIN<0.2V); f = fMAX |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||
|
|
|
| VCC(max)=2.25V | L |
|
| 0.5 |
| 18 |
| 0.5 |
| 18 |
|
|
| |||||||||||
|
| CMOS Inputs |
|
| (Address and Data |
|
|
|
|
|
|
|
| |||||||||||||||
|
|
|
|
|
| Only), f = 0 (OE, |
|
|
|
| LL |
|
|
|
| 12 |
|
|
| 12 |
|
|
| |||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||
|
|
|
|
|
| WE, BHE and BLE) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||
ISB2 |
| Automatic CE |
|
| CE | > VCC – 0.2V, | VCC(max)=1.95V | L |
|
| 0.5 |
| 12 |
| 0.5 |
| 12 |
|
| ∝A | ||||||||
|
|
|
| VIN > VCC – 0.2V or |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||
|
|
|
|
|
|
| LL |
|
|
|
| 8 |
|
|
| 8 |
|
|
| |||||||||
|
| Current — |
|
| VIN < 0.2V, f = 0 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||
|
|
|
| VCC(max)=2.25V | L |
|
| 0.5 |
| 18 |
| 0.5 |
| 18 |
|
|
| |||||||||||
|
| CMOS Inputs |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
| LL |
|
|
|
| 12 |
|
|
| 12 |
|
|
| ||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||
Capacitance for all Packages[8] |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||||||
Parameter |
|
|
|
| Description |
|
| Test Conditions |
|
| Max. |
|
| Unit | ||||||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||||||||
CIN |
|
| Input Capacitance |
|
| TA = 25°C, f = 1 MHz, |
|
| 10 |
|
|
| pF |
|
| |||||||||||||
|
|
|
|
|
| VCC = VCC(typ) |
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||||
COUT |
|
| Output Capacitance |
|
|
|
|
|
|
|
| 10 |
|
|
| pF |
|
| ||||||||||
Thermal Resistance |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||||||||
Parameter |
| Description |
|
|
|
| Test Conditions |
|
|
|
|
|
| BGA |
| Unit | ||||||||||||
|
|
|
|
|
|
|
|
| ||||||||||||||||||||
ΘJA |
| Thermal Resistance |
| Still Air, soldered on a 3 × 4.5 inch, |
| 75 |
| °C/W | ||||||||||||||||||||
|
|
| (Junction to Ambient)[8] |
| board |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||||
ΘJC |
| Thermal Resistance |
|
|
|
|
|
|
|
|
|
|
|
|
|
| 10 |
| °C/W | |||||||||
|
|
| (Junction to Case)[8] |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AC Test Loads and Waveforms
R1
VCC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
| VCC |
|
|
|
|
|
|
|
| ALL INPUT PULSES | |||||||||||
|
|
|
|
|
|
|
|
|
|
| 90% |
| |||||||||
| 10% |
|
|
|
|
|
| 90% |
|
|
|
|
|
|
| 10% | |||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||
| GND |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||
R2 | Rise Time = 1 V/ns |
|
|
|
|
|
|
|
|
|
|
|
|
|
| Fall Time = 1 V/ns | |||||
| Equivalent to: |
| THÉVENIN EQUIVALENT | ||||||||||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
| RTH | ||||||||
|
|
| OUTPUT |
|
|
|
|
|
|
|
|
| V | ||||||||
|
|
|
|
|
|
|
|
|
|
|
|
Parameters | 1.80V | Unit |
R1 | 13500 | Ω |
|
|
|
R2 | 10800 | Ω |
|
|
|
RTH | 6000 | Ω |
VTH | 0.80 | V |
Data Retention Characteristics (Over the Operating Range)
Parameter | Description |
| Conditions |
| Min. | Typ.[7] | Max. | Unit | |
VDR | VCC for Data Retention |
|
|
|
| 1.0 |
|
| V |
ICCDR | Data Retention Current | VCC= 1.0V | CE | > VCC – 0.2V, | L |
|
| 6 | ∝A |
|
| VIN > VCC – 0.2V or VIN < 0.2V |
|
|
|
|
| ||
|
| LL |
|
| 4 |
| |||
tCDR[8] | Chip Deselect to Data Retention Time |
|
|
|
| 0 |
|
| ns |
tR | Operation Recovery Time |
|
|
|
| tRC |
|
| ns |
Notes:
8.Tested initially and after any design or process changes that may affect these parameters.
Document #: | Page 4 of 11 |
[+] Feedback