PICK AND PLACE LOCATION |
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LEAD (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Temperature (°C )
250
200
150
100
50
2nd
140~180°C 60~120 sec.
Cooling down rate <3°C /sec.
Over 200°C 40~50sec.
0
60 |
| 120 | 180 |
| 240 |
| 300 |
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| Time ( sec. ) |
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LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Temp. |
| Peak Temp. 240 ~ 245 ℃ | ||
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220℃ |
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200℃ |
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| Preheat time |
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150℃ |
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| 90~120 sec. | |
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| Ramp up | ||
25℃ |
| max. 3℃/sec. | ||
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Ramp down max. 4℃/sec.
Time Limited 75 sec. above 220℃
Time
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
DS_DNM04SMD10_07162008
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