LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Temperature (°C )
250
200
150
100
50
2nd 
210~230°C 5sec.
140~180°C 60~120 sec.
Cooling down rate <3°C /sec.
Over 200°C 40~50sec.
0
60 |
| 120 | 180 |
| 240 |
| 300 |
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| Time ( sec. ) |
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Note: The temperature refers to the pin of S48SP, measured on the pin +Vout joint.
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
. |
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Temp | Peak Temp. 240 ~ 245 ℃ |
|
|
| |
217℃ |
| Ramp down |
200℃ |
| max. 4℃/sec. |
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| |
150℃ | Preheat time |
|
| 100~140 sec. | Time Limited 90 sec. |
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| |
| Ramp up | above 217℃ |
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25℃ | max. 3℃/sec. |
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| Time | |
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Note: The temperature refers to the pin of S48SP, measured on the pin +Vout joint.
DS_S48SP05007_05222008 | 12 |
