Delta Electronics Series E24SR manual Pick And Place Location, Recommended Pad Layout Smd

Models: Series E24SR

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DS_E24SR05012_01032008

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Contents

APPLICATIONS FEATURESDATASHEET DSE24SR0501201032008 OPTIONSDYNAMIC CHARACTERISTICS TECHNICAL SPECIFICATIONSINPUT CHARACTERISTICS OUTPUT CHARACTERISTICSELECTRICAL CHARACTERISTICS CURVES ELECTRICAL CHARACTERISTICS CURVES For Negative Remote On/Off LogicFor Positive Remote On/Off Logic Note Measured input reflected-ripple current with a simulated source Inductance LTEST of 12 μH. Capacitor Cs offset possible battery impedance. Measure current as shown above ELECTRICAL CHARACTERISTICS CURVESFigure 12 Input reflected ripple current, is, through a 12µH ELECTRICAL CHARACTERISTICS CURVESInput Source Impedance Safety ConsiderationsSoldering and Cleaning Considerations DESIGN CONSIDERATIONSOver-Voltage Protection FEATURES DESCRIPTIONSOver-Temperature Protection Over-Current ProtectionRtrim − down = ⎢ FEATURES DESCRIPTIONS CONOutput Voltage Adjustment TRIM Ex. When Trim-down -10% 5V×0.9=0.45VThermal Derating Thermal Testing SetupTHERMAL CONSIDERATIONS THERMAL CURVESSURFACE-MOUNT TAPE & REEL PICK AND PLACE LOCATIONRECOMMENDED PAD LAYOUT SMD Time LEADED Sn/Pb PROCESS RECOMMEND TEMP. PROFILELEAD FREE SAC PROCESS RECOMMEND TEMP. PROFILE TempPin No MECHANICAL DRAWINGSurface-mount module Through-hole moduleMODEL NAME PART NUMBERING SYSTEMMODEL LIST WARRANTYDSE24SR0501201032008 at any time, without notice