LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Temperature (°C )
250
200
150
100
50
2nd 
210~230°C 5sec.
140~180°C 60~120 sec.
Cooling down rate <3°C /sec.
Over 200°C 40~50sec.
0
60 |
| 120 | 180 |
| 240 |
| 300 |
|
|
|
|
| |||||
|
| Time ( sec. ) |
|
|
|
|
|
|
Note: The temperature refers to the pin of E24SR, measured on the pin +Vout joint.
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Temp. |
|
|
| Peak Temp. 240 ~ 245 ℃ |
|
217℃ |
| Ramp down |
200℃ |
| max. 4℃/sec. |
|
| |
150℃ | Preheat time |
|
| 100~140 sec. | Time Limited 90 sec. |
|
| |
| Ramp up | above 217℃ |
|
| |
25℃ | max. 3℃/sec. |
|
| Time | |
|
|
Note: The temperature refers to the pin of E24SR, measured on the pin +Vout joint.
DS_E24SR05012_01032008 | 12 |
