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1-1.1 S.E.C. Cartridge Overview
The entire enclosed product is called the Pentium® II Processor. The packaging technology and each of the physical elements of the product are referred to using accurate technical descriptions. This allows clear reference to the products as just a processor. This is the model used in past packaging technologies like PGA, TCP, PQFP, DIP, etc.
1-1.2 S.E.C. Cartridge Terminology
•Pentium® II Processor
The new enclosed card packaging technology is called a “Single Edge Contact cartridge.” This is similar to previous names for packaging technol- ogy such as PGA or TCP.
•Processor card
The green PCB (with or without components on it)
•Processor core
The silicon on the PLGA package on the PCB
•Cover
The plastic cover on the opposite side from the thermal plate.
•Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro processor uses Socket 8.
•Retention mechanism
Formerly ‘retention module’the dual posts, etc. that hold the cartridge in place.
•Thermal plate
The heatsink attachment plate.
•Heat sink supports
The support pieces that are mounted on the mainboard to provide added support for heatsinks.
The L2 cache (TagRAM, PBSRAM) components keep standard industry names. The Pentium® II Processor is the first product to utilize the S.E.C. cartridge technology and Slot 1 connector. Unless otherwise noted, any references to “Pentium® II Processor,” “Pentium® II Processor/Slot 1 processor” or Processor” will apply to both the Pentium® II Processor desktop processors.
