AN42APPLICATION NOTE
Table 11. Bill of Materials for a 14.5A Pentium Pro Motherboard Application
C13, C14, C15 | Sanyo | 1500∝F 6.3V electrolytic | ESR < 0.047 Ω |
| 6MV1500GX | capacitor 10mm x 20mm |
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DS1 | Motorola | Shottky Diode | Vf<0.72V @ If = 15A |
(note 1) | MBR1545CT |
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DS2 | General Instruments 1N5817 | Schottky Diode | 1A, 20V |
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L1 | Skynet | 1.3∝H inductor |
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L2* | Skynet | 2.5∝H inductor | *Optional – will help re- |
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| duce ripple on 5v line | |
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M1, M2, M3 | Fuji | RDS(ON) < 37m ohm | |
(note 2) | 2SK1388 | Enhancement Mode MOSFET | VGS < 4V, ID > 20A |
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Rsense | COPEL | 6 milliohm CuNi Alloy Wire |
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| A.W.G. #18 | resistor |
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R1, R2, R3, R4, R6, | Panasonic | 10K 5% Resistors |
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R7 |
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U1 | Raytheon |
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| RC5042M or RC5040M | Pro |
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Refer to Appendix A for Directory of component suppliers.
Notes:
1.In synchronous mode using the RC5040, a 1A schottky diode (1N5817) may be substituted for the MBR1545CT.
2.MOSFET M3 is only required for the RC5040 synchronous application.
PCB Layout Guidelines and Considerations
PCB Layout Guidelines
•Placement of the MOSFETs relative to the RC5040 is critical. The MOSFETs (M1 & M2), should be placed such that the trace length of the HIDRV pin to the FET gate is minimized. A long lead length causes high amounts of ringing due to the inductance of the trace and the large gate capacitance of the FET. This noise radiates all over the board, and because it is switching at a high voltage and frequency, it is very difficult to suppress.
Figure 16 shows an example of proper MOSFET placement in relation to the RC5040. It also shows an example of problematic placement for the MOSFETs.
In general, noisy switching lines should be kept away from the quiet analog section of the RC5040. That is, traces that connect to pins 12 and 13 (HIDRV and VCCQP) should be kept far away from the traces that connect to pins 1 through 5, and pin 16.
•Place the 0.1∝F decoupling capacitors as close to the RC5040 and RC5042 pins as possible. Extra lead length negates their ability to suppress noise.
•Each VCC and GND pin should have its own via to the appropriate plane on the board to add isolation between pins
•The CEXT timing capacitor should be surrounded with a ground trace. The placement of a ground or power plane underneath the capacitor provides further noise isolation, and helps to shield the oscillator from the noise on the PCB. This capacitor should be placed as close to pin 1 as possible.
•Group the MOSFETs, inductor, and Schottky diode as close together as possible. This minimizes ringing derived from the inductance of the trace and the large gate capacitance of the FET. Place the input bulk capacitors as
close to the drains of MOSFETs as possible. In addition, place the 0.1∝F decoupling capacitors right on the drain
of each MOSFET. This helps to suppress some of the high frequency switching noise on the
•The traces that run from the RC5040 IFB (pin 4) and VFB (pin 5) pins should be run next to each other and be Kelvin connected to the sense resistor. Running these lines together helps to reject some of the common mode noise to the RC5040 feedback input. Run the noisy switching signals (HIDRV & VCCQP) on one layer, and use the inner layers for power and ground only. If the top layer is being used to route all of the noisy switching signals, use the bottom layer to route the analog sensing signals VFB and IFB.
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