Fujitsu FBR211 manual Reflow Solder condition Flow Solder condition, Solder by Soldering Iron

FBR211 SERIES

RoHS Compliance and Lead Free Relay Information

1. General Information

•Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

•Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.

•All signal and most power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).

•It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible).

•“LF” is marked on each outer and inner carton. (No marking on individual relays).

•To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.

•We will ship leaded relays as long as the leaded relay inventory exists.

Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)

2.Recommended Lead Free Solder Profile

•Recommended solder paste Sn-3.0Ag-0.5Cu.

Reflow Solder condition

Flow Solder condition:

Pre-heating: maximum 120˚C

Soldering: dip within 5 sec. at 260˚C soler bath

Solder by Soldering Iron:

Soldering Iron
Temperature:	maximum 360˚C
Duration:	maximum 3 sec.

We highly recommend that you confirm your actual solder conditions

3. Moisture Sensitivity

•Moisture Sensitivity Level standard is not applicable to electromechanical realys.

4. Tin Whisker

•Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in house test.