Reverse Gas Flow Procedure

(CE Requirements ONLY)

1.Assure bleed flow valve is not engaged. Disconnect the oxygen hose from the gas source. Remove all outlet connections from the HELIO2 Blender to ensure that there is no outlet flow.

2.Place the free end of the oxygen supply hose under water. While gradually increasing the heliox supply pressure from 30-75 psi

(2.07-5.17 bar) check for leakage past the oxygen inlet check valve.

3.Replace the Duckbill Check Valve in the oxygen inlet, if leakage is >100 ml/min. Reference HELIO2 Blender Service Manual (P/N 506124).

4.Repeat steps 1-3 to check for leakage past the heliox inlet check valve.

OPERATING INSTRUCTIONS

CAUTION

Inspect the HELIO2 Blender for visual damage before use, DO NOT USE if damaged.

1.Secure Blender to wall or pole mount bracket.

2.Connect heliox and oxygen supply lines from HELIO2 Blender to heliox cylinder and oxygen supply.

3.Connect oxygen flowmeter to Blender outlet.

4.Adjust the Oxygen Concentration Dial to the prescribed concentration. The balance of the concentration will be helium exiting the flowmeter.

NOTE: The Oxygen Concentration Dial does not rotate 360°. DO NOT force dial beyond the oxygen concentration endpoints as this will damage the Blender.

5.Confirm the flow of heliox mixture to the patient.

6.Actual heliox concentration to the patient may vary due to entrainment of room air via the patient interface device.

CAUTION

•Refer to “Oxygen Flowmeter Conversion Chart” for corrected heliox flows.

•An oxygen flowmeter should be used on the outlets of the HELIO2 Blender along with the corresponding flow conversion chart.

•Actual flow from an oxygen flowmeter utilized to deliver heliox are higher than read on the flowmeter.

HELIO2

 

Blender

9

HELIUM-Oxygen

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Helio PM5500, PM5400 user manual Reverse Gas Flow Procedure, Operating Instructions
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PM5400, PM5500 specifications

The Helio PM5500 and PM5400 are advanced power management integrated circuits (PMICs) designed to optimize power usage and enhance the efficiency of modern electronic devices. These PMICs incorporate a range of key technologies and features that make them ideal for applications in smartphones, tablets, wearables, and IoT devices.

One of the standout features of the Helio PM5500 and PM5400 is their ability to support multiple output voltage levels, allowing them to power a variety of components within a device. This versatility is crucial for modern applications that require different voltage rails for processors, memory, and peripheral components. The output current capacity of these PMICs is robust, ensuring that even power-hungry modules can be efficiently powered.

Both PMICs are built on advanced power management technologies that enhance efficiency and thermal performance. They incorporate synchronous buck converters, which allow for higher efficiency and reduced thermal dissipation compared to traditional linear regulators. This is critical in portable devices that need to maximize battery life while maintaining performance.

Another key aspect of the Helio PM5500 and PM5400 is their integration of advanced protection features. These include overcurrent protection, thermal shutdown, and undervoltage lockout, which ensure reliability and safety during operation. Such features help safeguard sensitive components from potential damage, thereby extending the lifespan of the device.

The PMICs also support various communication protocols, enabling seamless integration with microcontrollers and application processors. This capability is essential for efficient power management strategies, allowing the PMICs to adjust their output dynamically based on real-time power demands.

Furthermore, the Helio PM5500 and PM5400 are designed with a compact footprint, making them suitable for space-constrained applications. Their small size does not compromise their performance, ensuring that manufacturers can achieve the desired balance between form factor and functionality.

In summary, the Helio PM5500 and PM5400 power management ICs are distinguished by their multi-voltage support, high efficiency, integrated protection mechanisms, and compact design. These features make them an excellent choice for a wide range of applications in the ever-evolving landscape of electronic devices. Their robust capabilities not only enhance the performance of devices but also contribute to energy efficiency, aligning with the growing demand for sustainable technology solutions.
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