●Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it
NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.
●Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it
NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory.
Component replacement procedures | 77 |
