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QuickSpecs
HP Compaq dx7500 Business PC
Technical Specifications - Environmental Data
| Polyethylene low density | 130g |
| Internal: |
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RoHS Compliance | ||
| laws and regulations, including the European Union Restriction of Hazardous | |
| Substances (RoHS) Directive. HP's goal is to exceed compliance obligations | |
| by meeting the requirements of the RoHS Directive on a worldwide basis. By | |
| July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels | |
| below legal limits) for all HP electronic products subject to the RoHS Directive, | |
| except where it is widely recognized that there is no technically feasible | |
| alternative (as indicated by an exemption under the EU RoHS Directive). | |
Material Usage | This product does not contain any of the following substances in excess of | |
| regulatory limits (refer to the HP General Specification for the | |
| Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/ | |
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| Asbestos |
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| Certain Azo Colorants |
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| Certain Brominated Flame Retardants – may not be used as flame | |
| retardants in plastics |
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| Cadmium |
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| Chlorinated Hydrocarbons |
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| Chlorinated Paraffins |
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| Formaldehyde |
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| Halogenated Diphenyl Methanes |
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| Lead carbonates and sulfates |
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| Lead and Lead compounds |
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| Mercuric Oxide Batteries |
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| Nickel – finishes must not be used on the external surface designed to | |
| be frequently handled or carried by the user. | |
| Ozone Depleting Substances |
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| Polybrominated Biphenyls (PBBs) |
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| Polybrominated Biphenyl Ethers (PBBEs) |
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| Polybrominated Biphenyl Oxides (PBBOs) | |
| Polychlorinated Biphenyl (PCB) |
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| Polychlorinated Terphenyls (PCT) |
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| Polyvinyl Chloride (PVC) – except for wires and cables, and certain | |
| retail packaging has been voluntarily removed from most applications. | |
| Radioactive Substances |
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| Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) | |
Packaging | HP follows these guidelines to decrease the environmental impact of product | |
| packaging: |
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Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.
Eliminate the use of
Design packaging materials for ease of disassembly.
Maximize the use of
DA - 13152 Worldwide QuickSpecs — Version 9 — 3/30/2009 | Page 46 |