HP G6 manual

Models: G6

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10.Remove the fan/heat sink assembly (4) by lifting straight up.

Each time the fan/heat sink assembly is removed, the thermal material must be thoroughly cleaned from the system board at locations (1) and (2), from the fan/heat sink assembly at locations (3) and

(5), and from the processor (4). Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled.

NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board, and processor spare part kits.

The following illustration shows the locations for thermal material on systems with Intel processors.

Each time the fan/heat sink assembly is removed, the thermal material must be thoroughly cleaned from the system board at locations (1), (2), and (4), from the fan/heat sink assembly at locations (3),

(5), and (7), and from the processor (6). Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled.

The following illustration shows the locations for thermal material on systems with AMD processors.

72 Chapter 4 Removal and replacement procedures

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HP G6 manual