IBM 170 manual POWER3 Versus POWER3-II Processors, Description

Floating	Floating	Fixed	Fixed	Fixed	LD/ST	LD/ST
Point	Point	Point	Point	Point	Unit	Unit
Unit	Unit	Unit	Unit	Unit
FPU1	FPU2	FXU1	FXU2	FXU3	LS1	LS2
Branch/Dispatch		Branch history table 2048 entries
		Branch target cache 256 entries
	32 KB, 128-way		64 KB, 128-way

Memory Mgmt Unit			Memory Mgmt Unit
Instruction Cache			Data Cache
	IU		DU
		32		32
		Bytes		Bytes
BIU		Bus Interface Unit L2 Control, Clock

CPU registers:

32 x 64-bit integer (Fixed Point)

32 x 64-bit FP (Floating Point)

Register buffers for register renaming: 24 FP

16 Integer

Direct Mapped

32 Bytes

@ 200 MHz=6.4 GB/s

L2 Cache

4 MB

16 Bytes

@ 100 MHz=1.6 GB/s

6XX Bus

Figure 3. Model 170 - POWER3-II 400 MHz Block Diagram

POWER3 Versus POWER3-II Processors

The processor functional diagram of the POWER3 and the POWER3-II are similar; however, the use of copper in the POWER3-II represents a new generation of processing power. A single POWER3-II chip contains about 400 meters of copper wiring. Table 1 lists some of the differences between the POWER3 and the POWER3-II processors. Also, the chart indicates the direction being taken by this technology.

Table 1. Differences between POWER3 versus POWER3-II

Description	POWER3	POWER3-II
Chip Die Size	270 mm2	163 mm2
Transistors	15 million	23 million
Power Avg/Max	39/46W@200 MHz	28W/36W@400 MHz
CMOS Technology	6S2, 5 layers metal	7S, 6 layers metal, copper
		interconnect
Lithography	0.25 μm	0.22 μm

4RS/6000 7044 Model 170 Technical Overview