Informazioni opzionali

4

Hub impilati

 

 

 

 

 

Up

 

Hub 1

Down

 

Module A

Cascade

• Disconnettere il cavo di alimentazione dagli hub.

• Utilizzare il cavo di collegamento in cascata

Hub 2

Up

 

incluso per connettere gli hub. È possibile

Down

 

Module A

Cascade

impilare fino a 5 hub (misti a 16 o 24 porte).

 

 

• Se connesso in modo appropriato, l’intero stack

Hub 3

Up

si comporta come un singolo ripetitore con due

Down

 

segmenti (10 Mbps e 100 Mbps). Il primo hub in

Module A

Cascade

 

 

alto sarà l’hub numero 1.

Cavo in cascata

 

 

 

Il bridge interno dell’hub connette automatica- mente i segmenti da 10 Mbps e 100 Mbps (domini di collisione) in tutto lo stack.

Modifica MDI/MDI-X

5 della Porta 1

Tutte le porte dell’hub sono di tipo MDI-X. Se si

 

preme il pulsante MDI/MDI-X la Porta 1 diventa

 

MDI, ed è possibile collegarla a un altro hub o

 

switch usando un cavo diretto.

Dato che il 330T è un hub di Classe II, non

Hub impilate: il cavo in cascata collega il connettore “Down” di un hub al connettore “Up” dell’hub sottostante.

 

Intel®

Express 330T Stackab

Italiano

 

 

MDI

1

2

3

4

 

MDI-X

 

 

 

 

 

Class II

 

 

 

 

 

connetterlo mai in daisy-chain (cascata) con un

hub di Classe I a 100 Mbps con del cavo UTP

(doppino ritorto non schermato). Questo tipo di

collegamento provoca un abbassamento delle

prestazioni della rete.

Aggiunta di moduli

6 facoltativi

Pulsante

MDI/MDI-X

Crossover

Intel® Express 300 Series

Ethernet Module

MDI

MDI-X

MDI

MDI-X

Modulo Ethernet per Hub Express 330T (EE300EM)

Gli hub 330T, sia quelli a 16 che a 24 porte, accettano moduli aggiuntivi (consultare la Guida dell’utente ).

Utilizzare i moduli opzionali per la gestione dello stack, per connettere i dispositivi in full- duplex o per estendere la rete ad un’altra costruzione o oltre i 100 metri.

Intel® Express 300 Series Fiber Module

Modulo Fibre per

 

 

Duplex

Hub Express 330T

 

 

 

 

 

Half

(EE300FX)

TX

RX

Full

 

 

 

 

 

 

EIA 232

Intel® Express 300 Series

 

 

 

Management Module

009027390005

 

 

MAC Address

 

Console: 9600-8-N-1

 

Modulo Management Hub per Express 330T (EE300MM)

10

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Intel 330T quick start Informazioni opzionali, Hub impilati, Modifica MDI/MDI-X Della Porta, Aggiunta di moduli Facoltativi

330T specifications

The Intel 330T is a noteworthy entry in the realm of hybrid processors, blending the power of traditional computing with the energy efficiency of mobile technology. Designed for Intel's low-power segment, this processor has garnered attention for its remarkable balance of performance and thermal management, making it ideal for a wide range of applications, from ultrabooks to compact PCs.

One of the standout features of the 330T is its architecture, which utilizes the Intel Core microarchitecture. This allows for improved performance per watt, offering users a more efficient experience that doesn't compromise on power. With a base clock speed typically around 1.9 GHz and capable of reaching higher frequencies due to Turbo Boost technology, the 330T can handle demanding tasks while maintaining a low energy footprint.

The 330T incorporates Intel’s Hyper-Threading technology, which allows each core to handle two threads simultaneously. This leads to enhanced multitasking capabilities and more efficient processing for applications that can take advantage of parallelism. With dual-core architecture, the processor provides solid performance for casual gaming, productivity applications, and multimedia tasks.

In terms of graphics, the Intel 330T is paired with Intel HD Graphics, which provides decent performance for everyday tasks and some light gaming. The integrated GPU is a significant advantage for devices where a dedicated graphics card isn’t feasible, maintaining a sleek form factor while still delivering visual prowess.

Another key technology featured in the 330T is Intel's Smart Cache. This shared cache architecture allows for improved data access speeds, reducing latency and enhancing overall system performance. The processor also supports Intel's Virtualization Technology, which can be beneficial for users running virtual machines or utilizing cloud-based applications.

The thermal design power (TDP) of the Intel 330T hovers around 35 watts, a critical specification for mobile and compact devices. This low TDP means that devices powered by this processor can operate without extensive cooling solutions, leading to quieter and more portable options.

Connectivity is another strong suit of the Intel 330T, with support for various standards such as USB 3.0, SATA interfaces, and advanced memory technologies like DDR3L RAM. This versatility ensures compatibility with a wide array of peripherals and storage options, further enhancing its appeal to users.

In summary, the Intel 330T processor represents a well-rounded solution for contemporary computing needs. Its combination of efficient performance, integrated graphics, and advanced technologies makes it suitable for various applications, providing an ideal choice for users seeking both power and efficiency in a compact form factor.