Etapes facultatives

 

4

Connectez les hubs

 

 

en cascade

Hub 1

Down

 

 

 

Up

 

• Débranchez le câble d’alimentation de tous

Module A

Cascade

 

 

 

 

les hubs.

 

 

 

 

Hub 2

Up

 

• Connectez les hubs en cascade à l’aide du câble

Down

 

 

 

prévu à cet effet. Vous pouvez combiner jusqu’à

Module A

Cascade

 

 

 

 

5 hubs (16 ou 24 ports).

 

 

 

• Lorsque les connexions sont établies correcte-

Hub 3

Up

 

Down

 

ment, la pile fonctionne comme un répéteur uni-

 

 

Module A

Cascade

que reliant deux segments (10 Mbps et 100 Mbps). Le hub figurant en haut de la pile porte le numéro 1.

Le pont interne du hub assure la liaison entre le segment à 10 Mbps et celui à 100 Mbps (domaine de collisions) pour toute la pile.

Câble de liaison en cascade

Connexion des hubs en cascade :

le câble doit être branché sur le connecteur « Bas » d’un hub et sur le connecteur « Haut » du hub figurant au-dessous.

Français

5 Configurez le port 1

Intel®

Express 330T Stackab

MDI

1

2

3

4

• Tous les ports des hubs sont de type MDI-X.

MDI-X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Le bouton MDI/MDI-X permet de définir le port

 

 

 

 

 

 

 

 

 

 

1 par MDI afin d’y connecter un autre hub ou un

Class II

 

 

 

 

 

 

 

 

 

commutateur à l’aide d’un câble direct.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Le hub 330T fait partie des appareils de classe II ; ne le raccordez jamais par chaînage à un hub de classe I fonctionnant à 100 Mbps à l’aide d’un câble UTP afin d’éviter une baisse des perfor- mances du réseau.

Ajoutez les modules

6 disponibles en option

Bouton

MDI/MDI-X

Crossover

Intel® Express 300 Series

Ethernet Module

MDI

MDI-X

MDI

MDI-X

Module Ethernet pour les hubs Express 330T (EE300EM)

Les hubs 330T à 16 et 24 ports permettent la connexion de modules disponibles en option (consultez le Guide de l’utilisateur ).

Ces modules permettent de gérer une pile, de connecter des périphériques en mode duplex intégral, de relier plusieurs bâtiments ou de prolonger le réseau de plus de100 mètres.

Intel® Express 300 Series Fiber Module

 

Module Fibre optique

 

Duplex

 

pour les hubs Express

 

 

 

 

 

Half

330T (EE300FX)

TX

RX

Full

 

 

 

 

EIA 232

Intel® Express 300 Series

 

 

Management Module

009027390005

 

 

MAC Address

Console: 9600-8-N-1

 

Module d’administration pour les hubs Express 330T (EE300MM)

8

Page 9
Image 9
Intel 330T quick start Etapes facultatives, Connectez les hubs En cascade, Ajoutez les modules Disponibles en option

330T specifications

The Intel 330T is a noteworthy entry in the realm of hybrid processors, blending the power of traditional computing with the energy efficiency of mobile technology. Designed for Intel's low-power segment, this processor has garnered attention for its remarkable balance of performance and thermal management, making it ideal for a wide range of applications, from ultrabooks to compact PCs.

One of the standout features of the 330T is its architecture, which utilizes the Intel Core microarchitecture. This allows for improved performance per watt, offering users a more efficient experience that doesn't compromise on power. With a base clock speed typically around 1.9 GHz and capable of reaching higher frequencies due to Turbo Boost technology, the 330T can handle demanding tasks while maintaining a low energy footprint.

The 330T incorporates Intel’s Hyper-Threading technology, which allows each core to handle two threads simultaneously. This leads to enhanced multitasking capabilities and more efficient processing for applications that can take advantage of parallelism. With dual-core architecture, the processor provides solid performance for casual gaming, productivity applications, and multimedia tasks.

In terms of graphics, the Intel 330T is paired with Intel HD Graphics, which provides decent performance for everyday tasks and some light gaming. The integrated GPU is a significant advantage for devices where a dedicated graphics card isn’t feasible, maintaining a sleek form factor while still delivering visual prowess.

Another key technology featured in the 330T is Intel's Smart Cache. This shared cache architecture allows for improved data access speeds, reducing latency and enhancing overall system performance. The processor also supports Intel's Virtualization Technology, which can be beneficial for users running virtual machines or utilizing cloud-based applications.

The thermal design power (TDP) of the Intel 330T hovers around 35 watts, a critical specification for mobile and compact devices. This low TDP means that devices powered by this processor can operate without extensive cooling solutions, leading to quieter and more portable options.

Connectivity is another strong suit of the Intel 330T, with support for various standards such as USB 3.0, SATA interfaces, and advanced memory technologies like DDR3L RAM. This versatility ensures compatibility with a wide array of peripherals and storage options, further enhancing its appeal to users.

In summary, the Intel 330T processor represents a well-rounded solution for contemporary computing needs. Its combination of efficient performance, integrated graphics, and advanced technologies makes it suitable for various applications, providing an ideal choice for users seeking both power and efficiency in a compact form factor.