2.0Packaging Technology

Packaging Technology

The Intel 6300ESB ICH component is available in a 37.5 mm square package as shown in Appendix A, “Mechanical Drawings”. Package information is also provided in the Intel® 6300ESB I/O Controller Hub Datasheet.

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

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Intel 6300ESB manual 2.0Packaging Technology

Contents

Thermal and Mechanical Design Guide Intel 6300ESB I/O Controller HubFebruary Contents Revision History ContentsFigures Tables This page intentionally left blank Table 1. Definition of Terms 1.0Introduction1.1Definition of Terms Introduction Reference Documents Reference DocumentsDocument Packaging Technology 2.0Packaging Technology Packaging Technology 3.2Case Temperature Metrology 3.0Thermal Specifications3.1Case Temperature and Thermal Design Power Thermal Specifications This page intentionally left blank Table 4. Reliability Requirements 4.0Reference Thermal SolutionReference Thermal Solution 4.1Reliability Requirements This page intentionally left blank Mechanical Drawings Appendix A Mechanical Drawings Mechanical Drawings