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Intel 6300ESB manual 2.0Packaging Technology

Models: 6300ESB

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Packaging Technology

2.0Packaging Technology

The Intel 6300ESB ICH component is available in a 37.5 mm square package as shown in Appendix A, “Mechanical Drawings”. Package information is also provided in the Intel® 6300ESB I/O Controller Hub Datasheet.

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

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Intel 6300ESB manual 2.0Packaging Technology

Contents

Thermal and Mechanical Design Guide Intel 6300ESB I/O Controller HubFebruary Contents Revision History ContentsFigures TablesContents This page intentionally left blankTable 1. Definition of Terms 1.0Introduction1.1Definition of Terms IntroductionDocument Reference DocumentsReference Documents IntroductionPackaging Technology 2.0Packaging TechnologyPackaging Technology This page intentionally left blank3.2Case Temperature Metrology 3.0Thermal Specifications3.1Case Temperature and Thermal Design Power Thermal SpecificationsThis page intentionally left blank Thermal SpecificationsTable 4. Reliability Requirements 4.0Reference Thermal SolutionReference Thermal Solution 4.1Reliability RequirementsThis page intentionally left blank Reference Thermal SolutionMechanical Drawings Appendix A Mechanical DrawingsMechanical Drawings