Intel 6300ESB manual 4.0Reference Thermal Solution, 4.1Reliability Requirements

Reference Thermal Solution

4.0Reference Thermal Solution

Based on a component local operating environment of natural convection (zero LFM of airflow) with a maximum local-ambient temperature of 55° C, the Intel 6300ESB ICH component does not require an attached heatsink to meet thermal specifications. For systems where the local-ambient temperature is severe (greater than 55° C, natural convection), a component level thermal solution or system thermal solution improvement may be required. Attaching a heatsink to the package case and/or improving airflow at the component may be potential solutions.

4.1Reliability Requirements

If an attached heatsink is implemented due to a severe component local operating environment, the reliability requirements in Table 4 are recommended. Each motherboard, heatsink, and attach combination may vary the mechanical loading of the component. It is recommended that the user carefully evaluate the reliability of the completed assembly prior to use in high volume.

Table 4. Reliability Requirements

Test1	Requirement	Pass/Fail Criteria2
Mechanical Shock	50g, board level, 11 msec, 3 shocks/axis	Visual check and electrical functional test
Random Vibration	7.3g, board level, 45 min/axis, 50 Hz to	Visual check and electrical functional test
	2000 Hz
Temperature Life	85° C, 2000 hours total, checkpoints at	Visual check
	168, 500, 1000, and 2000 hours
Thermal Cycling	-5° C to +70° C, 500 cycles, ° C/min rise	Visual check
	and fall
Humidity	85% relative humidity, 55° C, 1000 hours	Visual check

NOTES:

1.The above tests should be performed on a sample size of at least 12 assemblies from 3 lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 11