Intel 6300ESB manual 1.0Introduction, 1.1Definition of Terms

Introduction

1.0Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Heat may be dissipated using improved system cooling and/or attaching passive heatsinks.

The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits may be expected to meet specified performance requirements. Operation outside the functional limit may degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel® 6300ESB I/O Controller Hub (ICH).

The simplest and most cost effective method is to improve the inherent system cooling characteristics through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink may be varied to balance size and space constraints with acoustic noise.

This document presents the conditions and requirements to properly design a cooling solution for systems using the Intel 6300ESB ICH. Properly designed solutions should provide adequate cooling to maintain the Intel 6300ESB ICH case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the case temperatures of the Intel 6300ESB ICH at or below those recommended in this document, a system designer may ensure the proper functionality, performance, and reliability of these components.

1.1Definition of Terms

Table 1. Definition of Terms

Term	Definition
	Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
BGA	mounted, bonded and encapsulated in molding compound. The primary electrical interface is
	an array of solder balls attached to the substrate opposite the die and molding compound.
Tcase-nhs	The maximum package case temperature without any package thermal solution. This
	temperature is measured at the geometric center of the top of the package case.
Tj-max	The maximum component temperature specification measured at the hottest point in the
	processor die.
TDP	Thermal Design Power. Thermal solutions should be designed to dissipate this target power
	level.
LFM	Linear Feet Per Minute. A measure of airflow emitted from a forced convection device, such
	as an axial fan or blower.

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 5