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Intel Core 2, GME965, Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset 2.2 Included Hardware and Documentation , 2.3 Software Key Features

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Getting Started

316704-001 / Development Kit User’s Manual 17

Development Board

Implementation Comments

Power

Management

ACPI Compliant S0 – Power On

S3 – Suspend to RAM

S4 – Suspend to Disk

S5 – Soft Off

M0 – All Wells powered

M1 – Main Well down. Only ME power on

M-off – ME powered off

Form Factor ATX 2.2 like form factor 10 layer board – 12” x 10.2”

Note: Review the document provided with the Development Kit titled “Important Safety and

Regulatory Information”. This document contains safety warnings and cautions that

must be observed when using this development kit.

2.2 Included Hardware and Documentation

The following hardware and documentation is included in the development kit:

• One development board

• One Intel® CoreTM 2 Duo processor with 4 MB L2 Cache on 65nm process in

the 478 pin Flip-Chip Pin Grid Array (Micro-FCPGA) package (Installed)

• One Firmware Hub (FWH) (Installed)

• One GMCH (GME965) heatsink (Installed)

• One Type 2032, socketed 3 V lithium coin cell battery (Installed)

• One 256 MByte DDR2 SODIMM (200 Pin)

• One CPU thermal solution and CPU back plate (included in kit box – not

populated on board)

• One cable kit

• One Development Kit User’s Manual

• One Port 80 add-in card

2.3 Software Key Features

The driver CD included in the kit contains all of the software drivers necessary for

basic system functionality under the following operating systems: Windows* XP/XP

Embedded, Vista and Linux*.

Contents

Main Intel CoreTM 2 Duo processor and Mobile Intel GME965 Express Chipset Page Contents Figures Tables Revision History 1 About This Manual 1.1 Content Overview 1.2 Text Conventions Table 1. Text Conventions 1.3 Glossary of Terms and Acronyms Page Table 3 defines the acronyms used throughout this document. Table 3. Acronyms Page Page 1.4 Support Options 1.4.1 Electronic Support Systems 1.4.2 Additional Technical Support 1.5 Product Literature 1.6 Related Documents 2 Getting Started 2.1 Overview 2.1.1 Development Board Features Page 2.2 Included Hardware and Documentation 2.3 Software Key Features 2.3.1 AMI BIOS 2.4 Before You Begin Page 2.5 Setting Up the Development Board 2.6 Configuring the BIOS 3 Theory of Operation 3.3 Thermal Management 3.4 System Features and Operation 3.4.1 Mobile Intel GME965 GMCH 3.4.1.1 System Memory 3.4.1.2 DMI 3.4.1.3 Advanced Graphics and Display Interfaces 3.4.1.3.1 VGA Connector 3.4.1.3.2 LVDS Flat Panel Interface 3.4.2 ICH8-M 3.4.2.1 PCI Express* Slots 3.4.2.2 PCI Slots 3.4.2.3 On-Board LAN 3.4.2.4 High Definition Audio 3.4.2.5 ATA/ Storage 3.4.2.6 USB Connectors 3.4.2.7 LPC Super I/O (SIO)/LPC Slot 3.4.2.8 Serial, IrDA 3.4.2.9 BIOS Firmware Hub (FWH) 3.4.2.10 SPI 3.4.2.11 System Management Controller (SMC)/Keyboard Controller 3.4.2.12 Clocks 3.4.2.13 Real Time Clock 3.4.2.14 Thermal Monitoring 3.4.3 POST Code Debugger 3.5 Clock Generation 3.6 Power Management States Table 10. Power Management M-States 3.7 Power Measurement Support R V P = Table 12. Development Board Voltage Rails Page Page Page 4 Hardware Reference 4.1 Primary Features Table 13. Development Board Component Location Legend 4.2 Back Panel Connectors n o p q r s t u 4.2.1 TV-Out D-Connector 4.3 Configuration Settings Page Page Page 4.4 Power On and Reset Buttons 4.5 LEDs 4.6 Other Headers, Slots and Sockets 4.6.1 H8 Programming Headers 4.6.2 Expansion Slots and Sockets 4.6.2.1 478 Pin Grid Array (Micro-FCPGA) Socket 4.6.2.2 PCI Express* (x16) Page Page 4.6.2.3 ADD2/Media Expansion Card (MEC) Slot Page Page Table 20. MEC Slot (J6B2) Page 4.6.2.4 PCI Express* (x1) 4.6.2.5 IDE Connector 4.6.2.6 SATA Pinout 4.6.2.7 Fan Connectors 4.6.2.8 Front Panel Header (J6H5) 4.6.2.9 USB Headers (J6H3, J6H4) Appendix A . Heatsink Installation Instructions