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Intel Core 2, GME965, Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset - page 33

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Theory of Operation

316704-001 / Development Kit User’s Manual 33

Component

/ Interface Voltage

Plane Supply Rail Reference

Designator

GMCH 1.8V +V1.8 +V1.8_GMCH R5D1

GMCH 1.8V +V1.8_GMCH +V1.8_SM_CK R5D2

GMCH 1.8V +V1.8 +V1.8_TXLVDS R5U25

GMCH 1.8V +V1.8 +V1.8_DLVDS R5E5

GMCH 3.3V +V3.3S +V3.3S_HV R5U2

GMCH 3.3V +V3.3S +V3.3S_SYNC R5F9

GMCH 3.3V +VCCA_TVDAC +V3.3S_DAC_BG R5U19 (0.03Ω)

GMCH 3.3V +V3.3S +V3.3S_PEG_BG R6E3

PCI-E Gfx 3.3V +V3.3S +V3.3S_PEG R6C1

PCI-E Gfx 3.3V +V3.3 +V3.3S_PEG R6P2*

PCI-E Gfx Battery +VBATS +V12S_PEG R6N9

PCI-E Gfx Battery +VBAT_S4 +V12S_PEG R6N5*

ICH 1.05V +V1.05S +V1.05S_ICH R7F12

ICH 1.05V +V1.05S +V1.05S_ICH_IO R6V11

ICH 1.25V +V1.25S +V1.25S_DMI_ICH R6G3

ICH 1.5V +V1.5S +V1.5S_PCIE_ICH R6F13

ICH 1.5V +V1.5S +V1.5S_SATA_ICH R8G2

ICH 1.5V +V1.5S +V1.5S_USB_ICH R8F7

ICH 1.5V +V1.5S +V1.5S_APLL_ICH R8G2

ICH 3.3V +V3.3S +V3.3S_DMI_ICH R6G4

ICH 3.3V +V3.3S +V3.3S_GLAN_ICH R6F2

ICH 3.3V +V3.3M +V3.3M_ICH R7U3

ICH 3.3V +V3.3A +V3.3A_ICH R6V12

ICH 3.3V +V3.3A +V3.3A_USB_ICH R8F4

ICH 3.3V +V3.3S +V3.3S_IDE_ICH R8G1

ICH 3.3V +V3.3S +V3.3S_VCCPCORE_ICH R8V14

ICH 3.3V +V3.3M +V3.3M_VCCPAUX R7F1

ICH 3.3V +V3.3S +V3.3S_PCI_ICH R8F5

ICH 3.3V +V3.3S +V3.3S_SATA_ICH R8G7

ICH 3.3V +V3.3S_1.5S_HDA_IO +V3.3S_1.5S_HDA_IO_IC

H

R7V4 (0.022Ω)

Memory Battery +VBATA 1.8_VIN R5N13

Memory 0.9 V +V0.9 +V0.9_R R4B13

Memory 1.8V +V1.8 +V1.8_DIMM0 R5C2

Contents

Main Intel CoreTM 2 Duo processor and Mobile Intel GME965 Express Chipset Page Contents Figures Tables Revision History 1 About This Manual 1.1 Content Overview 1.2 Text Conventions Table 1. Text Conventions 1.3 Glossary of Terms and Acronyms Page Table 3 defines the acronyms used throughout this document. Table 3. Acronyms Page Page 1.4 Support Options 1.4.1 Electronic Support Systems 1.4.2 Additional Technical Support 1.5 Product Literature 1.6 Related Documents 2 Getting Started 2.1 Overview 2.1.1 Development Board Features Page 2.2 Included Hardware and Documentation 2.3 Software Key Features 2.3.1 AMI BIOS 2.4 Before You Begin Page 2.5 Setting Up the Development Board 2.6 Configuring the BIOS 3 Theory of Operation 3.3 Thermal Management 3.4 System Features and Operation 3.4.1 Mobile Intel GME965 GMCH 3.4.1.1 System Memory 3.4.1.2 DMI 3.4.1.3 Advanced Graphics and Display Interfaces 3.4.1.3.1 VGA Connector 3.4.1.3.2 LVDS Flat Panel Interface 3.4.2 ICH8-M 3.4.2.1 PCI Express* Slots 3.4.2.2 PCI Slots 3.4.2.3 On-Board LAN 3.4.2.4 High Definition Audio 3.4.2.5 ATA/ Storage 3.4.2.6 USB Connectors 3.4.2.7 LPC Super I/O (SIO)/LPC Slot 3.4.2.8 Serial, IrDA 3.4.2.9 BIOS Firmware Hub (FWH) 3.4.2.10 SPI 3.4.2.11 System Management Controller (SMC)/Keyboard Controller 3.4.2.12 Clocks 3.4.2.13 Real Time Clock 3.4.2.14 Thermal Monitoring 3.4.3 POST Code Debugger 3.5 Clock Generation 3.6 Power Management States Table 10. Power Management M-States 3.7 Power Measurement Support R V P = Table 12. Development Board Voltage Rails Page Page Page 4 Hardware Reference 4.1 Primary Features Table 13. Development Board Component Location Legend 4.2 Back Panel Connectors n o p q r s t u 4.2.1 TV-Out D-Connector 4.3 Configuration Settings Page Page Page 4.4 Power On and Reset Buttons 4.5 LEDs 4.6 Other Headers, Slots and Sockets 4.6.1 H8 Programming Headers 4.6.2 Expansion Slots and Sockets 4.6.2.1 478 Pin Grid Array (Micro-FCPGA) Socket 4.6.2.2 PCI Express* (x16) Page Page 4.6.2.3 ADD2/Media Expansion Card (MEC) Slot Page Page Table 20. MEC Slot (J6B2) Page 4.6.2.4 PCI Express* (x1) 4.6.2.5 IDE Connector 4.6.2.6 SATA Pinout 4.6.2.7 Fan Connectors 4.6.2.8 Front Panel Header (J6H5) 4.6.2.9 USB Headers (J6H3, J6H4) Appendix A . Heatsink Installation Instructions