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Intel Core 2, GME965, Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset 3 Theory of Operation

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Theory of Operation

22 316704-001 / Development Kit User’s Manual

3 Theory of Operation

3.1 Block Diagram

Figure 1. Development Board Block Diagram

3.2 Mechanical Form Factor

The development board conforms to the ATX form factor. For extra protection in a

development environment, you may want to install the development board in an ATX

Contents

Main Intel CoreTM 2 Duo processor and Mobile Intel GME965 Express Chipset Page Contents Figures Tables Revision History 1 About This Manual 1.1 Content Overview 1.2 Text Conventions Table 1. Text Conventions 1.3 Glossary of Terms and Acronyms Page Table 3 defines the acronyms used throughout this document. Table 3. Acronyms Page Page 1.4 Support Options 1.4.1 Electronic Support Systems 1.4.2 Additional Technical Support 1.5 Product Literature 1.6 Related Documents 2 Getting Started 2.1 Overview 2.1.1 Development Board Features Page 2.2 Included Hardware and Documentation 2.3 Software Key Features 2.3.1 AMI BIOS 2.4 Before You Begin Page 2.5 Setting Up the Development Board 2.6 Configuring the BIOS 3 Theory of Operation 3.3 Thermal Management 3.4 System Features and Operation 3.4.1 Mobile Intel GME965 GMCH 3.4.1.1 System Memory 3.4.1.2 DMI 3.4.1.3 Advanced Graphics and Display Interfaces 3.4.1.3.1 VGA Connector 3.4.1.3.2 LVDS Flat Panel Interface 3.4.2 ICH8-M 3.4.2.1 PCI Express* Slots 3.4.2.2 PCI Slots 3.4.2.3 On-Board LAN 3.4.2.4 High Definition Audio 3.4.2.5 ATA/ Storage 3.4.2.6 USB Connectors 3.4.2.7 LPC Super I/O (SIO)/LPC Slot 3.4.2.8 Serial, IrDA 3.4.2.9 BIOS Firmware Hub (FWH) 3.4.2.10 SPI 3.4.2.11 System Management Controller (SMC)/Keyboard Controller 3.4.2.12 Clocks 3.4.2.13 Real Time Clock 3.4.2.14 Thermal Monitoring 3.4.3 POST Code Debugger 3.5 Clock Generation 3.6 Power Management States Table 10. Power Management M-States 3.7 Power Measurement Support R V P = Table 12. Development Board Voltage Rails Page Page Page 4 Hardware Reference 4.1 Primary Features Table 13. Development Board Component Location Legend 4.2 Back Panel Connectors n o p q r s t u 4.2.1 TV-Out D-Connector 4.3 Configuration Settings Page Page Page 4.4 Power On and Reset Buttons 4.5 LEDs 4.6 Other Headers, Slots and Sockets 4.6.1 H8 Programming Headers 4.6.2 Expansion Slots and Sockets 4.6.2.1 478 Pin Grid Array (Micro-FCPGA) Socket 4.6.2.2 PCI Express* (x16) Page Page 4.6.2.3 ADD2/Media Expansion Card (MEC) Slot Page Page Table 20. MEC Slot (J6B2) Page 4.6.2.4 PCI Express* (x1) 4.6.2.5 IDE Connector 4.6.2.6 SATA Pinout 4.6.2.7 Fan Connectors 4.6.2.8 Front Panel Header (J6H5) 4.6.2.9 USB Headers (J6H3, J6H4) Appendix A . Heatsink Installation Instructions