Intel® Solid-State Drive 520 Series
February 2012 Product Specification
Order Number: 325968-001US 23
Intel® Solid-State Drive 520 Series
7.0 References

Tab le 15 identifies the standards information referenced in this document.

8.0 Terms and Acronyms

Tab le 16 defines the terms and acronyms used in this document.

Table 15. Standards References

Date or
Rev. # Title Location
Sept 2010 Solid-State Drive (SSD) Requirements and Endurance Test Metho d
(JESD218) http://www.jedec.org/standards-
documents/docs/jesd218/
Dec 2008 VCCI http://www.vcci.jp/vcci_e/
June 2009 RoHS
http://qdms.intel.com/
Click Search MDDS Database and search
for material description datasheet
August 2009 ACS-2 Specification http://www.t13.org/
June 2009 Serial ATA Revision 3.0 http://www.sata-io.org/
May 2006 SFF-8223, 2.5-inch Drive w/Serial Attachment Connector http://www.sffcommittee.org/
May 2005 SFF-8201, 2.5-inch drive form factor http://www.sffcommittee.org/
Compliance with EN 55022:1998 Information technology
equipment - Radio disturbance characteristics - Limits and
methods of measurement CISPR 22:1997 (Modified) http://www.iec.ch/

Table 16. Glossary of Terms and Acronyms

Term Definition
ATA Advanced Technology Attachment
DAS Device Activity Signal
DIPM Device Initiated Power Management
DMA Direct Memory Access
EXT Extended
FPDMA First Party Direct Memory Access
GB Gigabyte (1,000,000,000 bytes)
Note: The total usable capacity of the SSD may be less than the total physical capacity because a
small portion of the capacity is used for NAND flash management and maintenance purposes.
HDD Hard Disk Drive
HIPM Host Initiated Power Management
I/O Input/Output
IOPS Input/Output Operations Per Second
KB Kilobyte (1,024 bytes)
LBA Logical Block Address
LPM Link Power Management
MB Megabyte (1,000,000 bytes)
MLC Multi-level Cell
MTBF Mean Time Between Failures