LG Electronics GSA-4167B, GSA-4168B, GSA-4165B service manual Table of Contents

	TABLE OF CONTENTS
INTRODUCTION		3
FEATURES		3~5
SPECIFICATIONS		6~9
LOCATION OF CUSTOMER CONTROLS		10~11
DISASSEMBLY		12~13
1. CABINET and CIRCUIT BOARD DISASSEMBLY		12
1-1. Bottom Chassis		12
1-2. Front Bezel Assy		12
1-3. Cabinet and Main Circuit Board		12
2. MECHANISM ASSY DISASSEMBLY		12
2-1. Pick-up Unit		12
2-2. Pick-up		13
EXPLODED VIEW		14~15
MECHANICAL REPLACEMENT PARTS LIST		16~18
GLOSSARY		19
THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM		20~26
1.	Recording Layer	20
2.	Disc Specification	20
3.	Disc Materials	21
4.	Reading Process of Optical Disc	22
5.	Writing Process of CD-R Disc	23
6.	Writing Process of CD-RW Disc	23
7.	Organization of the PCA, PMA and Lead-in Area	24
8.	Function of PCA and PMA area	25
9. OPC and ROPC		25
10. Writing Process of DISC		26
THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVD-ROM		27~35
1.	Recording Layer	27
2.	Disc Specification	28
3.	Disc Materials	28
4.	Writing Pulse Waveform of DVD+R	31
5.	Writing Pulse Waveform DVD+RW	33
6.	Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone	34
LightScribe MEDIA		36~39
1.	LightScribe Media	36
2.	Hardware Block Diagram of LightScribe Label Printing	37
3.	MD Assy For LightScribe	38
4.	Optical Encoder Assy	39
DVD & CD DATA PROCESSING		40~43
1.	Data Processing Flow	40
2.	Copy Protection and Regional Code Management Block	41
3.	About Prevention the DVD-ROM from to be copy	42
4.	About the DVD-ROM Regional Code	43
INTERNAL STRUCTURE OF THE PICK-UP		44~46
1.	Block Diagram of the Pick-up(HOP-7632TS)	44
2.	Pick up Pin Assignment	45
3.	Signal detection of the P/U	46
DESCRIPTION OF CIRCUIT		47~53
1.	ALPC Circuit	47
2.	Focus Circuit	49
3.	Tracking & Sled Circuit	50
4.	Spindle Circuit	53
MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION		55~72
TROUBLESHOOTING GUIDE		73~90
BLOCK DIAGRAM		91
PRINTED CIRCUIT BOARD DIAGRAM		92~96
ELECTRICAL REPLACEMENT PARTS LIST		97

CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.