Philips Semiconductors Product specification

Logic level TOPFET PIP3119-P
MECHANICAL DATA

Fig.2. SOT78B (TO220AB) package1, pin 2 connected to mounting base.

REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT78B
D
D1
q
L
123
L1
b1
ee
b(1)
0 5 10 mm
scale

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-leads SOT78B

DIMENSIONS (mm are the original dimensions)
A
E
A1
c
Notes
1. The positional accuracy of the terminals is controlled within zone L1 max.
2. Mounting base configuration is not defined within the dimensions E and D
Q
L2
UNIT A1b1D1e∅ p
mm 2.54
qQ
Ab(1) D
cL2
max.
3.0 3.8
3.6 4.3
4.1
15.0
13.5 3.30
2.79 3.0
2.7 2.6
2.2
w
0.4
0.7
0.4 15.8
15.2
0.85
0.60 1.3
1.0
4.5
4.1 1.39
1.27 6.4
5.9 10.3
9.7
L1p1
EL
01-02-22
mounting
base
(2)
wM
∅ p
p1

1 Refer to mounting instructions for SOT78 (TO220) envelopes. Epoxy meets UL94 V0 at 1/8". Net mass: 2 g

May 2001 5 Rev 1.000