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NXP Semiconductors SA58670A 15. Abbreviations, 16. Revision history

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SA58670A_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 23 October 2008 22 of 24

NXP Semiconductors SA58670A

2.1 W/channel stereo class-D audio ampliﬁer

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”

.

15. Abbreviations16. Revision history

MSL: Moisture Sensitivity Level

Fig 19. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 9. Abbreviations

Acronym Description

DAP Die Attach Paddle

DVD Digital Video Disc

EMI ElectroMagnetic Interference

ESR Equivalent Series Resistance

LC inductor-capacitor ﬁlter

PC Personal Computer

PCB Printed-Circuit Board

PDA Personal Digital Assistant

PWM Pulse Width Modulator

USB Universal Serial Bus

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

SA58670A_2 20081023 Product data sheet - SA58670A_1

Modiﬁcations: •Table 4 “Static characteristics”:

–added IDD(sd) speciﬁcation

SA58670A_1 20080220 Product data sheet - -

Contents

Main 1. General description 2. Features 3. Applications SA58670A Rev. 02 23 October 2008 Product data sheet 2.1 W/channel stereo class-D audio amplier Product data sheet Rev. 02 23 October 2008 2 of 24 2.1 W/channel stereo class-D audio amplier nEducational toy 4. Ordering information Fig 1. Block diagram 5. Block diagram Refer toTable 6 for gain selection. SA58670A 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). NXP Semiconductors SA58670A 8. Static characteristics C; unless otherwise specied =25 T . 9. Dynamic characteristics ; unless otherwise specied =8 =25 T 10. Typical performance curves Fig 3. Total harmonic distortion-plus-noise as a function of output power; RL=8 a. Gv(cl) =24dB b. Gv(cl) = 6 dB. fi=1 kHz. (1) VDD= 2.5 V. (2) VDD= 3.6 V. (3) VDD= 5.0 V. NXP Semiconductors SA58670A a. Gv(cl) =24dB. Fig 4. Total harmonic distortion-plus-noise as a function of output power; RL=4 b. Gv(cl) = 6 dB. fi=1 kHz. (1) VDD= 2.5 V. (2) VDD= 3.6 V. (3) VDD= 5.0 V. Fig 5. Total harmonic distortion-plus-noise as a function of frequency; VDD= 2.5 V Fig 6. Total harmonic distortion-plus-noise as a function of frequency; VDD= 3.6 V Fig 7. Total harmonic distortion-plus-noise as a function of frequency; VDD= 5.0 V Fig 8. Crosstalk (stepped all-to-one) as a function of frequency (1) Left channel. (2) Right channel. Fig 9. Noise output voltage (RMS value) as a function of frequency (1) VDD = 2.5 V. Fig 10. Crosstalk (one-to-one) as a function of frequency (3) VDD = 5.0 V. (1) left channel; RL=8. (2) right channel; RL=4. (3) right channel; RL=8. (1) VDD = 2.5 V. Fig 13. Supply current as a function of output power (3) VDD = 5.0 V. (1) VDD = 5.0 V. Fig 14. Power dissipation as a function of output power (3) VDD = 2.5 V. Fig 15. Output power efciency as a function of output power (1) VDD = 5.0 V. (3) VDD = 2.5 V. 11. Application information 11.1 Power supply decoupling considerations 11.2 Input capacitor selection 11.3 PCB layout considerations 11.4 Filter-free operation and ferrite bead lters 11.5 Efciency and thermal considerations 12. Test information 11.6 Additional thermal information 13. Package outline SOT917-1 Fig 18. Package outline SOT917-1 (HVQFN20) 14. Soldering of SMD packages 14.4 Reow soldering For further information on temperature proles, refer to Application Note AN10365 Surface mount reow soldering description . 15. Abbreviations 16. Revision history Product data sheet Rev. 02 23 October 2008 23 of 24 17. Legal information 17.1 Data sheet status 17.2 Denitions 17.3 Disclaimers 17.4 Trademarks 19. Contents