Panasonic ASCT1F46E manual Automatic Soldering, Hand Soldering, Cooling 6. Cleaning 7. Coating

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4. Soldering

Automatic Soldering

•Flow solder is the optimum method for soldering.

•Adjust the level of solder so that it does not overflow onto the top of the PC board.

•Unless otherwise specified, solder under the following conditions depending on the type of relay.

Solder	Approx.260°C±5°C/
Temperature	500°F±41°F
Soldering Time	Within approx. 6
	seconds

Hand Soldering

•Please take caution with multi-layer boards. Relay performance may degrade due to the high thermal capacity of these boards

•Keep the tip of the soldering iron clean.

Soldering Iron	30W to 60W
Iron Tip	Approx. 350°C
Temperature
Soldering Time	Within approx. 3
	seconds

5. Cooling

6. Cleaning

7. Coating

•Immediate air cooling is recommend to prevent deterioration of the relay and surrounding parts due of soldering heat.

•Although environmentally the sealed type relay (plastic sealed type, etc.) can be cleaned, avoid immersing the relay into cold liquid (such as cleaning solvent and coating material) immediately after soldering. Doing so may deteriorate the sealing performance.

•Do not clean dust-cover type relays and flux-resistant type relays by immersion. Even if only the bottom surface of the PC board is cleaned (e.g. with a brush), careless cleaning may cause cleaning solvent to penetrate the relay.

•Plastic sealed type relays can be cleaned by immersion. Use an alcohol-based cleaning solvent. Use of other cleaning solvents (e.g. Trichlene, chloroethene, thinner, benzyl alcohol, gasoline) may damage the relay case.

•Cleaning with the boiling method is recommended. Avoid ultrasonic cleaning on relays. Use of ultrasonic cleaning may cause breaks in the coil or slight sticking of the contacts due to the ultrasonic energy.

•Do not cut the terminals. When terminals are cut, breaking of coil wire and slight sticking of the contacts may occur due to vibration of the cutter.

•If the PC board is to be coated to prevent the insulation of the PC board from deteriorating due to corrosive gases and high temperatures, note the following.

•Do not coat dust-cover type relays and flux-resistant type relays, since the coating material may penetrate the relay and cause contact failure. Or, mount the relay after coating.

•Depending on the type, some coating materials may have an adverse affect on relays. Furthermore, some solvents (e.g. xylene, toluene, MEK, I.P.A.) may damage the case or chemically dissolve the epoxy and break the seal. Select coating materials carefully.

•If the relay and all components (e.g. ICs) are to be coated, be sure to carefully check the flexibility of the coating material. The solder may peel off from thermal stress.

Coating	Suitability	Features
material type	for Relays
		Good electrical insulation.
Epoxy-base	Good	Although slightly difficult to apply, does not affect
		relay contacts.
Urethane-base	Care	Good electrical insulation, easy to apply.
		Solvent may damage case. Check before use.
Silicon-base	No Good	Silicon gas becomes the cause of contact failure.
		Do not use the silicon-base type.