Light Touch Switches/EVQPU

Recommended Reflow Soldering Conditions

 

 

 

Embossed Carrier Taping

 

 

MAX.

 

 

 

 

 

 

260

Fan or Normal Temp.

Tape width=12.0 mm

 

 

(°C)

230

 

t1

Feeding hole

Chip pocket

180

 

 

 

φD0

P2

P0

Top

 

 

 

150

 

 

 

 

 

Operation

 

 

B

 

 

 

 

 

 

 

 

 

 

 

A

 

 

(Normal Temp.)

 

t2

Chip component

 

P1

 

 

 

 

 

90±30

40±10

 

 

 

 

 

Soldering Time (s)

 

 

 

 

 

W

F E

Tape running direction

 

 

 

 

 

 

 

 

 

 

 

 

Unit: mm

Part No.

Height

A

B

W

F

E

P1

P2

P0

D0 Dia.

t1

t2

 

 

 

 

 

 

 

 

 

 

 

 

 

EVQPU

1.65

7.0±0.2

5.75±0.20

12.0±0.3

5.78±0.10

1.75±0.10

8.0±0.1

2.0±0.1

4.0±0.1

1.5+0–0.1

0.35±0.05

2.4±0.2

 

 

 

 

 

 

 

 

 

 

 

 

 

Standard Reel Dimensions in mm (not to scale)

T

E

C

B

rD

Item

A

B

C

D

E

 

 

 

 

 

 

Rate (mm)

φ370.0±2.0

φ50.0 min.

φ13.0±0.5

φ21.0±1.0

2.0±0.5

 

 

 

 

 

 

 

 

 

 

 

 

Item

W

T

t

r

 

 

 

 

 

 

 

Rate (mm)

14.0±1.5

1.0 to 3.0

1.0±0.5

 

A

W t

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

 

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Jun. 2006

 

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Panasonic EVQPU specifications Recommended Reflow Soldering Conditions, Embossed Carrier Taping