Philips BGY1916 2000 Oct 17 7, Philips Semiconductors Product specication, PACKAGE OUTLINE

2000 Oct 17 7
Philips Semiconductors Product specification
UHF amplifier module BGY1916
PACKAGE OUTLINE
UNIT QbpZc eU2 U1 UFpq
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
99-02-06
IEC JEDEC EIAJ
mm 4.0
3.8
0.56
0.46
A
9.5
9.0 0.3
0.2
D
30.1
29.9
E
18.6
18.4 12.8 12.6
4.1
3.9 40.74 40.54
2.54
e1
17.78 3.25
3.15
L
6.5
6.1 7.75
7.55
15.4
15.2
48.0
48.4 0.3 0.25
vw
0.1
y
DIMENSIONS (mm are the original dimensions)
SOT365A
0 10 20 mm
scale
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT365A
p
U2
F
A
U1
U
D
q
E
L
y
Q
c
vA
A
wM
bp
Z
234
1
e
1
ee