Philips PDIUSBH12 specifications

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PDIUSBH12

USB 2-port hub

Product specification

Supersedes data of 1999 Feb 25 1999 Jul 22

INTEGRATED CIRCUITS

Contents

Main PDIUSBH12USB 2-port hub Philips Semiconductors Product specification 1999 Jul 22 3 BLOCK DIAGRAM SV00852 REPEATER END OF FRAME TIMERS PHILIPS SIE Analog Transceivers Hub Repeater End of Frame Timers General and Individual Port Controller PLL ENDPOINT DESCRIPTIONS Table 1. SINGLE EMBEDDED FUNCTION MODE (DEFAULT AT POWER UP) Table 2. MULTIPLE (3) EMBEDDED FUNCTION MODE PINNING Pin configuration Pin Description Pin description (MODE 0 Good Link) Pin description (MODE 1 Individual Overcurrent) APPLICATION DIAGRAM I2C Interface C Handbook I ADDRESS TABLE COMMAND SUMMARY COMMAND DESCRIPTIONS Command Procedure Initialization Commands Set Address / Enable Set Endpoint Enable Set Mode PDIUSBH12USB 2-port hub Configuration Byte endpoint descriptions Clock Division Factor Byte Data Flow Commands Read Interrupt Register Select Endpoint Read Last Transaction Status Table 3. Error codes Write Buffer Clear Buffer Validate Buffer Set Endpoint Status Acknowledge Setup Hub Commands Clear/Set Port Feature Table 4. Get Port Status Set Status Change Bits General Commands Send Resume Read Current Frame Number Embedded Function Host Requests SetFeature PORT_RESET SetFeature PORT_ENABLE RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS DC CHARACTERISTICS (Digital pins) DC CHARACTERISTICS (AI/O pins) LOAD FOR D+/D AC CHARACTERISTICS (AI/O pins, FULL speed) AC CHARACTERISTICS (AI/O pins, LOW speed) Philips Semiconductors Product specification SV00514 Figure 3. Hub EOP Delay and EOP Skew 1999 Jul 22 22 Figure 2. Hub Differential Data Delay and SOP distortion AC CHARACTERISTICS (I2C pins) C-bus and how to use it The I Page Page SOLDERING Introduction Data Handbook IC26; Integrated Circuit Packages Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE M ANUAL SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. Definitions Disclaimers Data sheet status