Philips PNX2000 , 13.4 Manual soldering, 13.5 Package related soldering information

Product data Rev. 03 – 23 August 2004 28 of 31

Philips Semiconductors PNX2000

Audio video input processor

—larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

—smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thiev es at the downstream end.

•For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin tr ansfer or syringe

dispensing. T he package can be sold er ed after the ad h es i ve is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or

265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most

applications.

13.4 Manual soldering

Fix the component b y first soldering two diagonally-opposite en d leads . Use a lo w v oltage

(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320 °C.

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

Tab l e 27: Suitability of surface mount IC packages for wave and reflow soldering methods

Package [1] Soldering method

Wave Reflow [2]

BGA, LBGA, LFBGA, SQFP, SSOP-T[3], TFBGA,

VFBGA not suitable suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP,

HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable[4] suitable

PLCC[5], SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended [5] [6] suitable

SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable

PMFP[8] not suitable not suitable