Philips PNX2000 14. Revision history

Product data Rev. 03 – 23 August 2004 29 of 31

Philips Semiconductors PNX2000

Audio video input processor

[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reflow soldering with

peak temperature e x ceeding 217 °C ±10 °C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] W av e soldering is suitab le f or SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Hot bar or manual soldering is suitable for PMFP packag es.

14. Revision history

Tabl e 28: Revision history

Rev Date CPCN Description

03 20040823 Minor revision (9397 750 13928)

02 20040712 Upgraded to Product data (9397 750 13591). Table 3 and Table 4 added.

01 20040504 Preliminary data (9397 750 12066)