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Philips TDA1563Q 2000 Feb 09 13, Fig.9 PCB layout (soldering side) for the application of Fig.7.

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2000 Feb 09 13

Philips Semiconductors Product speciﬁcation

2× 25 W high efﬁciency car radio power

ampliﬁer TDA1563Q

handbook, full pagewidth

76.20

35.56

MGR190

GND

2× 25 W high efficiency

1 µF

Out2 Out1

In1

In2

220 nF 220 nF

220 nF

Fig.9 PCB layout (soldering side) for the application of Fig.7.

Dimensions in mm.

Contents

Main 225 W high efciency car radio power 2000 Feb 09 3 amplier TDA1563Q Fig.1 Block diagram. BLOCK DIAGRAM Page 2 25 W high efciency car radio power amplier TDA1563Q amplier TDA1563Q Page Page Page 2000 Feb 09 10 Fig.5 Clip detection waveforms. Fig.6 Protection waveforms. Fig.5 Clip detection waveforms. Io t 2000 Feb 09 11 TEST AND APPLICATION INFORMATION Fig.7 Application diagram. TDA1563Q TDA1563Q Fig.8 PCB layout (component side) for the application of Fig.7. 2000 Feb 09 12 2000 Feb 09 13 2 25 W high efficiency Fig.9 PCB layout (soldering side) for the application of Fig.7. 2000 Feb 09 14 Fig.10 Dissipation; sine wave driven. Fig.12 IEC-268 filter. Fig.11 Dissipation; pink noise through IEC-268 filter. 2000 Feb 09 15 amplier TDA1563Q TDA1563Q 2000 Feb 09 16 Fig.15 IP as a function of Vms (pin 3). Fig.17 THD +noise as a function of Po. Fig.16 Output power as a function of VP. Fig.14 Quiescent current as a function of VP. 2000 Feb 09 17 Fig.19 Gain as a function of frequency. Fig.21 SVRR as a function of frequency. Fig.18 THD +noise as a function of frequency. Fig.20 Channel separation as a function of frequency. 2000 Feb 09 18 Fig.22 AC operating as a function of VP. 2000 Feb 09 19 Fig.23 Output waveforms. Page 2000 Feb 09 21 Car-audio chip-set demonstrator Fig.24 PCB layout. Car-audio chip-set demonstrator 2000 Feb 09 22 handbook, full pagewidth Fig.25 Car-audio chip-set demonstrator (continued in Fig.26). MICROCONTROLLER MGS825 2000 Feb 09 23 handbook, full pagewidth Fig.26 Car-audio chip-set demonstrator (continued from Fig.25). TDA1563Q MGS826 Page 2 25 W high efciency car radio power Page 2000 Feb 09 27 PACKAGE OUTLINE DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 Data Handbook IC26; Integrated Circuit Packages Page Page Page Philips Semiconductors a worldwide company Printed in The Netherlands