Philips TDA8542 2 1 W BTL audio amplier TDA8542

1998 Apr 01 5

Philips Semiconductors Product speciﬁcation

2× 1 W BTL audio ampliﬁer TDA8542

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611-E”

. The number of the quality specification can be found in the

“Quality Reference

Handbook”

. The handbook can be ordered using the code 9397 750 00192.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage operating −0.3 +18 V

VIinput voltage −0.3 VCC + 0.3 V

IORM repetitive peak output current −1A

T

stg storage temperature non-operating −55 +150 °C

Tamb operating ambient temperature −40 +85 °C

Vpsc AC and DC short-circuit safe voltage −10 V

Ptot total power dissipation SO16L −1.2 W

DIP16 −2.2 W

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air:

TDA8542T (SO16L) 100 K/W

TDA8542 (DIP16) 55 K/W

Contents

Main 2 1 W BTL audio amplier TDA8542 1998 Apr 01 3 BLOCK DIAGRAM TDA8542 Fig.1 Block diagram. Page 2 1 W BTL audio amplier TDA8542 SNW-FQ-611-E Quality Reference Handbook Page Page 2 1 W BTL audio amplier TDA8542 1998 Apr 01 9 BTL APPLICATION Fig.5 THD as a function of Po. Fig.4 Iq as a function of VCC. Fig.3 BTL application. 1998 Apr 01 10 60 Fig.9 Po as a function of VCC. Fig.8 SVRR as a function of frequency. f (Hz) 1998 Apr 01 11 Fig.10 Worst case power dissipation as a function of VCC. Fig.13 Vms as a function of VP. Fig.12 Vo as a function of Vms. Fig.11 Pdis as a function of Po. 1998 Apr 01 12 SE APPLICATION Fig.16 THD as a function of frequency. Fig.15 THD as a function of Po. Fig.14 Single-ended application. 1998 Apr 01 13 Fig.17 Channel separation as a function of frequency. Fig.19 Po as a function of VCC. Fig.18 SVRR as a function of frequency. Fig.20 Worst case power dissipation as a function of VCC. 1998 Apr 01 14 Fig.21 Power dissipation as a function of Po. 1998 Apr 01 15 a. Top view. b. Component side. Fig.22 Printed-circuit board layout (BTL and SE). 1998 Apr 01 16 PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1998 Apr 01 17 DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 IC Package Databook Page Philips Semiconductors a worldwide company Printed in The Netherlands