Philips TDA8542 - page 6

1998 Apr 01 6

Philips Semiconductors Product speciﬁcation

2× 1 W BTL audio ampliﬁer TDA8542

DC CHARACTERISTICS

VCC =5V; T

amb =25°C; RL=8Ω; VMODE = 0 V; measured in test circuit Fig.3; unless otherwise speciﬁed.

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

to the DC output offset voltage divided by RL.

2. The DC output voltage with respect to ground is approximately 0.5 ×VCC.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage operating 2.2 5 18 V

Iqquiescent current RL=∞; note 1 −15 22 mA

Istb standby current VMODE =V

CC −−10 µA

VODC output voltage note 2 −2.2 −V

VOUT+ −VOUT−differential output voltage offset −−50 mV

IIN+, IIN−input bias current −−500 nA

VMODE input voltage mode select operating 0 −0.5 V

mute 1.5 −VCC −1.5 V

standby VCC −0.5 −VCC V

IMODE input current mode select 0 < VMODE <V

CC −−20 µA

VBS input voltage BTL/SE pin single-ended 0 −0.6 V

BTL 2 −VCC V

IBS input current BTL/SE pin VBS =0 −−100 µA

Contents

Main 2 1 W BTL audio amplier TDA8542 1998 Apr 01 3 BLOCK DIAGRAM TDA8542 Fig.1 Block diagram. Page 2 1 W BTL audio amplier TDA8542 SNW-FQ-611-E Quality Reference Handbook Page Page 2 1 W BTL audio amplier TDA8542 1998 Apr 01 9 BTL APPLICATION Fig.5 THD as a function of Po. Fig.4 Iq as a function of VCC. Fig.3 BTL application. 1998 Apr 01 10 60 Fig.9 Po as a function of VCC. Fig.8 SVRR as a function of frequency. f (Hz) 1998 Apr 01 11 Fig.10 Worst case power dissipation as a function of VCC. Fig.13 Vms as a function of VP. Fig.12 Vo as a function of Vms. Fig.11 Pdis as a function of Po. 1998 Apr 01 12 SE APPLICATION Fig.16 THD as a function of frequency. Fig.15 THD as a function of Po. Fig.14 Single-ended application. 1998 Apr 01 13 Fig.17 Channel separation as a function of frequency. Fig.19 Po as a function of VCC. Fig.18 SVRR as a function of frequency. Fig.20 Worst case power dissipation as a function of VCC. 1998 Apr 01 14 Fig.21 Power dissipation as a function of Po. 1998 Apr 01 15 a. Top view. b. Component side. Fig.22 Printed-circuit board layout (BTL and SE). 1998 Apr 01 16 PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1998 Apr 01 17 DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 IC Package Databook Page Philips Semiconductors a worldwide company Printed in The Netherlands