Philips TEA5880TS 15. Application information

Preliminary data sheet Rev. 02 — 26 April 2004 20 of 27

Philips Semiconductors TEA5880TS

Integrated FM stereo radio IC for host processor tuning

15. Application information

(1) optional.

Fig 11. Application diagram.

001aaa672

FM antenna

TEA5880FM

LL1

LR1

100 nF (1)

RFIN

VCCA

VCCD

LED

AUDL

MPX

CLOCK

DATA

R/W

AUDR

VCC1

Contents

Main 1. General description 2. Features TEA5880TS Rev. 02 26 April 2004 Preliminary data sheet Integrated FM stereo radio IC for host processor tuning in handheld applications 3. Quick reference data V = V 4. Ordering information V = V Preliminary data sheet Rev. 02 26 April 2004 4 of 27 TEA5880TS 5. Block diagram Philips Semiconductors TEA5880TS TEA5880TS Fig 2. Block diagram (no external components). 6. Pinning information 6.1 Pin description Preliminary data sheet Rev. 02 26 April 2004 7 of 27 TEA5880TS 7. Functional description Fig 3. Pin conguration. 7.1 FM quadrature mixer The digital interface controls the audio mute and output level. 7.2 Quadrature oscillator 8. Digital interface (3-wire bus) 8.1 Register description Page Page Page 8.2 Accessing the TEA5880TS 8.3 Writing to the TEA5880TS 8.4 Reading from the TEA5880TS 8.5 Measuring frequency with the TEA5880TS 9. Timing diagrams Fig 6. Reading data. Fig 7. Measuring sequence. 10. Limiting values 11. Thermal characteristics 12. Characteristics In accordance with the Absolute Maximum Rating System (IEC 60134). 13. Components list No external components necessary. (1) Mono signal. (2) Mono noise. (3) Stereo left. (4) Stereo right. (5) Stereo noise. Fig 9. Total harmonic distortion. Fig 8. Signal characteristics. 14. Printed-circuit board layout for SSOP24 package Preliminary data sheet Rev. 02 26 April 2004 20 of 27 15. Application information TEA5880FM (1) optional. Fig 11. Application diagram. 16. Package outline Fig 12. Package outline. SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 17. Soldering 17.1 Introduction to soldering surface mount packages Data Handbook IC26; Integrated Circuit Packages 17.2 Reow soldering 17.3 Wave soldering Page Page Preliminary data sheet Rev. 02 26 April 2004 26 of 27 19. Data sheet status 20. Denitions 21. Disclaimers 22. Contact information 23. Contents